Microchip Technology_LE58QL021BVC
original

Microchip Technology
LE58QL021BVC

702-LE58QL021BVC
PDF Datasheet
IC TELECOM INTERFACE 44TQFP
7 weeks

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Tech Specifications

Operating Temperature
-40°C ~ 85°C
ECCN
5A991G
Mounting Type
Surface Mount
Current - Supply
-
Product Status
Obsolete
Supplier Device Package
44-TQFP (10x10)
Series
-
Function
Subscriber Line Interface Concept (SLIC)
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LE58QL021BVC Description

LE58QL021BVC Description

The LE58QL021BVC is a Subscriber Line Interface Concept (SLIC) integrated circuit designed by Microchip Technology. This interface IC chip is engineered to provide robust and efficient telecommunication interface solutions. It features a 44-pin TQFP package, making it suitable for surface mount applications. The LE58QL021BVC operates at a supply voltage of 3.3V and is designed to meet stringent industry standards, including REACH and RoHS3 compliance. This product is categorized under Interface IC Chips and is identified by the base product number LE58QL021. It is important to note that the LE58QL021BVC is currently marked as obsolete, which may impact its availability and future support.

LE58QL021BVC Features

The LE58QL021BVC offers several unique features that set it apart from similar models in the market. It supports a PCM interface, enabling seamless communication and data transfer in telecommunication systems. The chip includes four circuits, enhancing its capability to manage multiple lines efficiently. Its surface mount mounting type ensures easy integration into modern printed circuit board designs. The moisture sensitivity level (MSL) of 3 (168 hours) ensures that the component remains stable and reliable in various environmental conditions. Additionally, the LE58QL021BVC is packaged in trays, facilitating bulk handling and storage.

LE58QL021BVC Applications

The LE58QL021BVC is ideal for a range of telecommunication applications where reliable and efficient line interfacing is crucial. It is particularly well-suited for use in telecommunication equipment such as PBX systems, VoIP gateways, and digital subscriber line (DSL) modems. The SLIC functionality allows for effective management of subscriber lines, ensuring clear and stable communication. The PCM interface capability further enhances its suitability for digital telecommunication systems, where high-speed data transfer and signal processing are essential. The 3.3V supply voltage ensures compatibility with modern low-power systems, making it a versatile choice for various applications.

Conclusion of LE58QL021BVC

In summary, the LE58QL021BVC by Microchip Technology is a highly capable SLIC IC designed for telecommunication applications. Its features, such as the PCM interface, four circuits, and surface mount compatibility, make it a robust solution for managing multiple subscriber lines efficiently. Despite its obsolete status, the LE58QL021BVC remains a reliable choice for applications requiring a proven and compliant telecommunication interface. Its REACH and RoHS3 compliance ensures that it meets environmental and safety standards, making it a responsible choice for modern electronics. For those seeking a reliable and efficient SLIC solution, the LE58QL021BVC is a noteworthy option, provided that its obsolete status is taken into consideration.

FAQ

What is LE58QL021BVC?
LE58QL021BVC is a Telecom from Microchip Technology. This product page provides its main specifications, pricing information, availability, and inquiry options.
What operating temperature range does LE58QL021BVC support?
What package or case is LE58QL021BVC available in?
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