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LPC47M112-MW
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LPC47M112-MW Description
LPC47M112-MW Description
The LPC47M112-MW from Microchip Technology is a specialized interface IC designed for high-performance backplane communication systems. Packaged in a 100-QFP (Quad Flat Package), this surface-mount device operates at 3.3V and complies with LPC (Low Pin Count) interface standards, making it suitable for embedded and industrial applications. With an ECCN 3A991A2 classification and RoHS3 compliance, it meets stringent environmental and regulatory requirements. Although marked as obsolete, it remains relevant for legacy systems requiring reliable, low-power interfacing solutions. Its MSL 3 (168 hours) rating ensures robustness during handling and assembly.
LPC47M112-MW Features
- LPC Interface: Optimized for low-pin-count systems, reducing board complexity.
- 3.3V Operation: Low-voltage design for energy-efficient performance.
- Surface-Mount (SMT) Packaging: Enables compact PCB integration in space-constrained applications.
- RoHS3 & REACH Compliant: Adheres to global environmental standards.
- High Reliability: MSL 3 rating ensures moisture resistance during assembly.
- Tray Packaging: Protects components during shipping and storage.
LPC47M112-MW Applications
- Embedded Systems: Ideal for legacy industrial PCs and automation controllers.
- Backplane Communication: Facilitates reliable data transfer in server and networking equipment.
- Legacy Upgrades: Suitable for maintaining or upgrading older systems requiring LPC interfacing.
- Low-Power Designs: Fits energy-sensitive applications due to its 3.3V operation.
Conclusion of LPC47M112-MW
The LPC47M112-MW offers a balanced combination of low-power operation, compact packaging, and compliance with industry standards, making it a pragmatic choice for legacy and specialized systems. While obsolete, its LPC interface and 3.3V supply ensure compatibility with older designs, particularly in backplane and embedded applications. Engineers seeking a reliable, RoHS-compliant solution for constrained environments will find this IC a viable option.



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