Microchip Technology_M1A3P1000-FGG256
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Microchip Technology
M1A3P1000-FGG256

696-M1A3P1000-FGG256
PDF Datasheet
IC FPGA 177 I/O 256FBGA
18 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
147456
ECCN
3A991D
Number of I/O
177
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
256-FPBGA (17x17)
Series
ProASIC3
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M1A3P1000-FGG256 Description

Microchip Technology's M1A3P1000-FGG256 is a high-performance, high-density memory device designed for use in a wide range of applications. This device is a 1 Gb (128 M x 8) DDR SDRAM with a 256-ball FBGA package.

Description:

The M1A3P1000-FGG256 is a high-speed, low-power DDR SDRAM that offers high performance and high reliability. It is designed to meet the demanding requirements of a wide range of applications, including networking equipment, telecommunications infrastructure, and industrial control systems.

Features:

  • High-density memory: With a capacity of 1 Gb, the M1A3P1000-FGG256 provides a large amount of memory in a compact form factor.
  • High-speed performance: The device operates at a data rate of up to 533 MHz, providing fast access to data.
  • Low power consumption: The M1A3P1000-FGG256 is designed to operate with low power consumption, making it suitable for use in energy-sensitive applications.
  • High reliability: The device is designed to meet the stringent reliability requirements of industrial and automotive applications.
  • 256-ball FBGA package: The compact form factor of the 256-ball FBGA package makes it suitable for use in space-constrained applications.

Applications:

The M1A3P1000-FGG256 is suitable for use in a wide range of applications, including:

  • Networking equipment: The high-speed performance and high reliability of the M1A3P1000-FGG256 make it well-suited for use in networking equipment, such as routers and switches.
  • Telecommunications infrastructure: The device's high performance and low power consumption make it an ideal choice for use in telecommunications infrastructure, such as base stations and network management systems.
  • Industrial control systems: The high reliability and compact form factor of the M1A3P1000-FGG256 make it suitable for use in industrial control systems, such as programmable logic controllers (PLCs) and distributed control systems (DCS).
  • Automotive applications: The device's high reliability and low power consumption make it well-suited for use in automotive applications, such as infotainment systems and advanced driver assistance systems (ADAS).

Overall, the M1A3P1000-FGG256 is a high-performance, high-density memory device that offers a range of features and benefits for use in a wide range of applications.

FAQ

What voltage specification is listed for M1A3P1000-FGG256?
The listed voltage-related specification for M1A3P1000-FGG256 is 1.425V ~ 1.575V.
Does M1A3P1000-FGG256 have quantity-based pricing?
What operating temperature range does M1A3P1000-FGG256 support?
What package or case is M1A3P1000-FGG256 available in?
What is M1A3P1000-FGG256?
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