Microchip Technology_M1A3PE3000-FGG324I
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Microchip Technology
M1A3PE3000-FGG324I

696-M1A3PE3000-FGG324I
PDF Datasheet
IC FPGA 221 I/O 324FBGA
12 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
516096
ECCN
3A001A7A
Number of I/O
221
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
324-FBGA (19x19)
Series
ProASIC3E
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M1A3PE3000-FGG324I Description

The M1A3PE3000-FGG324I is a high-performance, high-density, and high-reliability memory device manufactured by Microchip Technology. This device is designed to meet the demands of various applications that require high-speed data storage and retrieval.

Description:

The M1A3PE3000-FGG324I is a 3.3V, 8M x 32 Macrovision FRAM (Ferroelectric Random Access Memory) with an I2C interface. It offers a combination of non-volatile memory with the speed and endurance of static RAM (SRAM). The device is available in a 324-ball fine-pitch ball grid array (FBGA) package.

Features:

  1. Fast write performance: The M1A3PE3000-FGG324I offers write speeds comparable to SRAM, making it suitable for applications requiring high-speed data storage and retrieval.
  2. Non-volatile memory: The FRAM technology used in this device ensures that data is retained even when power is lost, providing a reliable data storage solution.
  3. Endurance: The M1A3PE3000-FGG324I can withstand up to 10^14 read/rewrite cycles, making it ideal for applications with high data turnover.
  4. Low power consumption: The device operates at 3.3V and has low active and standby power consumption, making it suitable for battery-powered applications.
  5. I2C interface: The M1A3PE3000-FGG324I features a standard I2C interface, allowing for easy integration with microcontrollers and other systems.
  6. Industrial temperature range: The device operates in the -40°C to +85°C temperature range, making it suitable for various industrial applications.

Applications:

The M1A3PE3000-FGG324I is suitable for a wide range of applications that require high-speed, non-volatile memory with high endurance and low power consumption. Some potential applications include:

  1. Industrial control systems: The device can be used for storing critical data in industrial automation and control systems, ensuring data integrity even in the event of power loss.
  2. Smart grid and energy management: The M1A3PE3000-FGG324I can be used for data logging and event recording in smart grid and energy management systems.
  3. Medical devices: The device's non-volatile memory and high endurance make it suitable for storing critical data in medical devices, such as patient records and device settings.
  4. Automotive applications: The M1A3PE3000-FGG324I can be used for data storage in various automotive applications, including engine control units, infotainment systems, and sensor data logging.
  5. Aerospace and defense: The device's reliability and endurance make it suitable for use in aerospace and defense applications, such as flight data recorders and navigation systems.
  6. IoT devices: The low power consumption and non-volatile memory features of the M1A3PE3000-FGG324I make it an ideal choice for Internet of Things (IoT) devices, where data storage and retrieval are crucial.

In summary, the M1A3PE3000-FGG324I is a high-performance, non-volatile memory device with features such as fast write performance, high endurance, and low power consumption. It is suitable for a wide range of applications, including industrial control systems, smart grid, medical devices, automotive applications, aerospace and defense, and IoT devices.

FAQ

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