Microchip Technology_M2GL090TS-1FCS325
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Microchip Technology
M2GL090TS-1FCS325

696-M2GL090TS-1FCS325
PDF Datasheet
IC FPGA 180 I/O 325BGA
10 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
2648064
ECCN
3A991B2
Number of I/O
180
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
325-FCBGA (11x11)
Series
IGLOO2
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M2GL090TS-1FCS325 Description

Microchip Technology's M2GL090TS-1FCS325 is a high-performance, low-power NAND flash memory module designed for use in a wide range of applications. This module is based on the company's advanced 3D NAND technology, which provides high storage density, high reliability, and low power consumption.

Description:

The M2GL090TS-1FCS325 is a 96GB (1TB) NAND flash memory module that is available in a compact, 1.8V UFS package. It features a high-speed interface that supports data transfer rates of up to 11.6Gbps, making it suitable for use in high-performance applications such as mobile devices, embedded systems, and automotive electronics.

Features:

Some of the key features of the M2GL090TS-1FCS325 include:

  1. High Storage Density: With a storage capacity of 96GB (1TB), this module provides ample storage for a wide range of applications.
  2. Low Power Consumption: The module is designed to operate at low voltage levels, which helps to reduce power consumption and extend battery life in mobile devices.
  3. High Reliability: The module is built using Microchip's advanced 3D NAND technology, which provides high endurance and data retention.
  4. Compact Form Factor: The module is available in a compact 1.8V UFS package, making it suitable for use in space-constrained applications.
  5. High-Speed Interface: The module supports data transfer rates of up to 11.6Gbps, making it suitable for use in high-performance applications.

Applications:

The M2GL090TS-1FCS325 is suitable for use in a wide range of applications, including:

  1. Mobile Devices: The module's high storage capacity and low power consumption make it ideal for use in smartphones, tablets, and other mobile devices.
  2. Embedded Systems: The module's compact form factor and high reliability make it suitable for use in embedded systems such as industrial control systems, medical devices, and automotive electronics.
  3. Automotive Electronics: The module's high reliability and wide operating temperature range make it suitable for use in automotive electronics such as infotainment systems, navigation systems, and advanced driver assistance systems (ADAS).
  4. Data Centers: The module's high storage density and high-speed interface make it suitable for use in data center applications such as cloud storage and big data analytics.

Overall, the M2GL090TS-1FCS325 is a high-performance, low-power NAND flash memory module that offers a combination of high storage density, high reliability, and low power consumption. Its compact form factor and high-speed interface make it suitable for use in a wide range of applications, from mobile devices to data centers.

FAQ

What operating temperature range does M2GL090TS-1FCS325 support?
M2GL090TS-1FCS325 has an operating temperature range of 0°C ~ 85°C (TJ).
What package or case is M2GL090TS-1FCS325 available in?
Are there related or alternative parts for M2GL090TS-1FCS325?
Is M2GL090TS-1FCS325 currently in stock?
What is the standard lead time for M2GL090TS-1FCS325?
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