Microchip Technology_M2GL090TS-FGG676
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Microchip Technology
M2GL090TS-FGG676

696-M2GL090TS-FGG676
PDF Datasheet
IC FPGA 425 I/O 676FBGA
10 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
2648064
ECCN
3A991B2
Number of I/O
425
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
676-FBGA (27x27)
Series
IGLOO2
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M2GL090TS-FGG676 Description

Microchip Technology's M2GL090TS-FGG676 is a high-performance, high-density NAND flash memory device designed for a wide range of applications. This device offers a storage capacity of 96 gigabits (Gb) and is available in a compact 665-ball fine-pitch ball grid array (FBGA) package.

Description:

The M2GL090TS-FGG676 is a 3.3V NAND flash memory device that utilizes Microchip's advanced 3D NAND technology. This technology allows for higher storage density and improved performance compared to traditional 2D NAND flash memory devices. The device features a page size of 16K bytes and a block size of 256K bytes, providing efficient data storage and retrieval.

Features:

  1. High storage density: With a storage capacity of 96 Gb, the M2GL090TS-FGG676 offers a high-density storage solution for a wide range of applications.
  2. Compact form factor: The device is available in a 665-ball FBGA package, making it suitable for use in space-constrained applications.
  3. Advanced 3D NAND technology: The M2GL090TS-FGG676 utilizes Microchip's advanced 3D NAND technology, providing higher storage density and improved performance compared to traditional 2D NAND flash memory devices.
  4. Wide operating temperature range: The device operates over a wide temperature range of -40°C to +85°C, making it suitable for use in various environments.
  5. Error-correcting code (ECC) support: The M2GL090TS-FGG676 supports error-correcting code, ensuring data integrity and reliability.

Applications:

The M2GL090TS-FGG676 is suitable for a wide range of applications, including:

  1. Industrial and automotive applications: Due to its wide operating temperature range and robust performance, the M2GL090TS-FGG676 is ideal for use in industrial and automotive applications where reliability and durability are crucial.
  2. Consumer electronics: The high storage capacity and compact form factor make the M2GL090TS-FGG676 suitable for use in consumer electronics such as smartphones, tablets, and other portable devices.
  3. Data storage and backup: The M2GL090TS-FGG676 can be used for data storage and backup solutions, providing a reliable and high-density storage option.
  4. Embedded systems: The device can be integrated into embedded systems for various applications, including IoT devices, medical equipment, and more.
  5. Networking and communication equipment: The M2GL090TS-FGG676 can be used in networking and communication equipment to store firmware, configuration data, and other essential information.

In summary, the Microchip Technology's M2GL090TS-FGG676 is a high-performance, high-density NAND flash memory device that offers a range of features and benefits, making it suitable for various applications across different industries.

FAQ

What is the standard lead time for M2GL090TS-FGG676?
The standard lead time for M2GL090TS-FGG676 is 10 Weeks.
What package or case is M2GL090TS-FGG676 available in?
Are there related or alternative parts for M2GL090TS-FGG676?
What is M2GL090TS-FGG676?
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