Microchip Technology_M2GL090TS-FGG676I
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Microchip Technology
M2GL090TS-FGG676I

696-M2GL090TS-FGG676I
PDF Datasheet
IC FPGA 425 I/O 676FBGA
10 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
2648064
ECCN
3A991B2
Number of I/O
425
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
676-FBGA (27x27)
Series
IGLOO2
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M2GL090TS-FGG676I Description

The M2GL090TS-FGG676I is a high-performance, low-power, and high-density NAND flash memory device manufactured by Microchip Technology. This device is designed to provide reliable and efficient data storage for various applications, including industrial, automotive, and consumer electronics.

Description:

The M2GL090TS-FGG676I is a 96Gb (12.8GB) 3-bit Multi-Level Cell (MLC) NAND flash memory chip, which is based on a 32nm process technology. It features a 162-ball Fine-Pitch Ball Grid Array (FBGA) package, making it suitable for high-density applications.

Features:

  1. High storage capacity: With a storage capacity of 12.8GB, the M2GL090TS-FGG676I can store large amounts of data, making it ideal for applications that require high-capacity memory.
  2. 3-bit Multi-Level Cell (MLC) technology: This technology allows the device to store three bits of data per memory cell, increasing its storage density and reducing overall system cost.
  3. Low power consumption: The M2GL090TS-FGG676I is designed to operate with low power consumption, making it suitable for battery-powered devices and energy-efficient systems.
  4. High reliability: The device features advanced error-correction capabilities and wear leveling algorithms, ensuring data integrity and extending the lifespan of the memory.
  5. Wide operating temperature range: The M2GL090TS-FGG676I can operate in a wide temperature range of -40°C to +85°C, making it suitable for various environments and applications.
  6. Advanced NAND flash technology: The device utilizes Microchip's advanced NAND flash technology, providing high performance, high endurance, and low latency.

Applications:

The M2GL090TS-FGG676I is suitable for a wide range of applications, including:

  1. Industrial control systems: The device's high reliability and wide temperature range make it ideal for use in industrial control systems, where data integrity and system stability are crucial.
  2. Automotive applications: The M2GL090TS-FGG676I can be used in automotive systems for infotainment, navigation, and telematics, providing high-capacity storage and reliable data access.
  3. Consumer electronics: The device's high storage capacity and low power consumption make it suitable for use in smartphones, tablets, and other portable devices.
  4. Data center storage: The M2GL090TS-FGG676I can be used in data center storage systems, providing high-density storage solutions for large-scale data storage and retrieval.
  5. Solid-state drives (SSDs): The device can be used as a key component in SSDs, offering high-performance, high-capacity storage solutions for various computing applications.

In summary, the M2GL090TS-FGG676I is a high-performance, low-power, and high-density NAND flash memory device that offers a combination of high storage capacity, reliability, and advanced features, making it suitable for a wide range of applications in various industries.

FAQ

What is the standard lead time for M2GL090TS-FGG676I?
The standard lead time for M2GL090TS-FGG676I is 10 Weeks.
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What is M2GL090TS-FGG676I?
What operating temperature range does M2GL090TS-FGG676I support?
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