Microchip Technology_M2S010-FGG484

Microchip Technology
M2S010-FGG484  
System On Chip (SoC)

M2S010-FGG484
777-M2S010-FGG484
Ersa
Microchip Technology-M2S010-FGG484-datasheets-5859359.pdf
IC SOC CORTEX-M3 166MHZ 484FBGA
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M2S010-FGG484 Description

M2S010-FGG484 Description

The M2S010-FGG484 is a high-performance System on Chip (SoC) from Microchip Technology, designed for demanding embedded applications. This SoC integrates a Cortex-M3 processor running at 166MHz, providing robust computational capabilities. It features a comprehensive set of peripherals, including DDR, PCIe, and SERDES, making it highly versatile for a variety of applications. The M2S010-FGG484 is housed in a 484-pin BGA package, ensuring a compact and efficient design.

M2S010-FGG484 Features

  • High-Speed Performance: The Cortex-M3 core operates at 166MHz, ensuring rapid processing and efficient execution of complex tasks.
  • Robust Memory Architecture: Equipped with 256KB of flash memory and 64KB of RAM, the M2S010-FGG484 offers ample storage for both program code and data.
  • Advanced Peripherals: The inclusion of DDR, PCIe, and SERDES peripherals enhances connectivity and data transfer capabilities, making it suitable for high-speed communication and data-intensive applications.
  • Extensive I/O Options: With 233 I/O pins, the M2S010-FGG484 provides extensive connectivity options, supporting a wide range of external devices and interfaces.
  • Versatile Connectivity: The SoC supports multiple communication protocols, including CANbus, Ethernet, I2C, SPI, UART/USART, and USB, facilitating seamless integration into various systems.
  • Reliability and Compliance: The M2S010-FGG484 is REACH unaffected and RoHS3 compliant, ensuring it meets stringent environmental and safety standards. It also has a moisture sensitivity level (MSL) of 3, allowing for 168 hours of exposure before assembly.
  • Wide Operating Temperature Range: The SoC operates reliably within a temperature range of 0°C to 85°C (TJ), making it suitable for industrial and automotive applications.
  • Dual Architecture: Combining an MCU and FPGA architecture, the M2S010-FGG484 offers the flexibility to implement both programmable logic and microcontroller functionalities.

M2S010-FGG484 Applications

The M2S010-FGG484 is ideal for a range of applications due to its high performance, extensive connectivity, and robust memory architecture. Key applications include:

  • Industrial Automation: The SoC's high-speed processing and extensive I/O capabilities make it suitable for controlling complex machinery and systems in industrial environments.
  • Automotive Systems: The wide operating temperature range and high reliability ensure that the M2S010-FGG484 can operate effectively in the demanding conditions of automotive applications.
  • Communication Systems: The support for multiple communication protocols and high-speed peripherals makes it ideal for networking and communication equipment.
  • Medical Devices: The SoC's reliability and compliance with environmental standards make it suitable for use in medical devices where precision and safety are paramount.

Conclusion of M2S010-FGG484

The M2S010-FGG484 from Microchip Technology is a versatile and high-performance SoC that offers a comprehensive set of features and capabilities. Its combination of a Cortex-M3 core, extensive memory, and advanced peripherals makes it a powerful solution for a wide range of embedded applications. The SoC's reliability, compliance with industry standards, and extensive connectivity options ensure it is well-suited for industrial, automotive, and communication systems. The M2S010-FGG484 stands out as a reliable and efficient choice for engineers and designers looking to integrate a high-performance SoC into their projects.

Tech Specifications

Program Memory Type
Logic Elements
PPAP
Product Status
Automotive
Total Number of Block RAM
Tradename
Supplier Package
Device Logic Units
Number of I/O Banks
Package / Case
REACH Status
EMACs
Family Name
Maximum Operating Supply Voltage (V)
EU RoHS
Primary Attributes
Moisture Sensitivity Level (MSL)
Operating Temperature
Architecture
ECCN
Supplier Temperature Grade
In-System Programmability
Standard Package Name
Pin Count
Reprogrammability Support
Mounting
Lead Shape
Copy Protection
Connectivity
HTSUS
Package
Speed Grade
User I/Os
Programmability
Core Processor
PCB changed
HTS
ECCN (US)
PCIe
SERDES Channels
Supplier Device Package
Operating Supply Voltage (V)
Minimum Operating Temperature (°C)
Maximum Operating Temperature (°C)
Process Technology
Package Height
Mfr
I/O Voltage (V)
RoHS Status
Speed
Device Number of DLLs/PLLs
Number of Multipliers
Flash Size
RAM Size
Number of I/O
Embedded Memory (Kbit)
Peripherals
Package Length
Series
Part Status
Package Width
Base Product Number
Minimum Operating Supply Voltage (V)
Mounting Style
Number of Logic Elements
Number of Logic Array Blocks - LABs
RoHS
Minimum Operating Temperature
Moisture Sensitive
Operating Supply Voltage
Maximum Clock Frequency
Number of I/Os
Program Memory Size
Maximum Operating Temperature
USHTS
Data RAM Size
Number of Cores
Core

M2S010-FGG484 Documents

Download datasheets and manufacturer documentation for M2S010-FGG484

Ersa Manufacturing Change 23/Feb/2021      
Ersa IGL002 FPGA,SmartFusion2 Datasheet       SmartFusion2 Product Brief       SmartFusion2 Pin Descriptions      
Ersa Software 19/Apr/2023      
Ersa IGL002 FPGA,SmartFusion2 Datasheet       SmartFusion2 Product Brief       SmartFusion2 Pin Descriptions      
Ersa Software 19/Apr/2023       Software 20/Apr/2023      
Ersa Microchip CA Prop65       Microchip RoHS       Microchip REACH      

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