Microchip Technology
M2S060-FGG676

777-M2S060-FGG676
PDF Datasheet
IC SOC CORTEX-M3 166MHZ 676FBGA
10 Weeks

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Tech Specifications

Program Memory Type
Flash
Logic Elements
56520
PPAP
No
Product Status
Active
Automotive
No
Total Number of Block RAM
72
Tradename
SmartFusion
Supplier Package
FBGA
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M2S060-FGG676 Description

M2S060-FGG676 Description

The M2S060-FGG676 is a high-performance System-on-Chip (SoC) from Microchip Technology's SmartFusion®2 series, designed for demanding embedded applications. This SoC integrates a Cortex-M3 microcontroller with a field-programmable gate array (FPGA), offering a powerful combination of processing capabilities and programmable logic. The device operates at a speed of 166MHz, ensuring efficient and rapid data processing. It features 256KB of flash memory and 64KB of RAM, providing ample storage for both program code and data. The M2S060-FGG676 is housed in a 676-ball BGA package, which is ideal for compact and high-density designs.

M2S060-FGG676 Features

  • High-Speed Performance: The M2S060-FGG676 operates at a speed of 166MHz, delivering fast and efficient processing capabilities.
  • Robust Memory Architecture: Equipped with 256KB of flash memory and6 4KB of RAM, this SoC can handle complex applications with ease.
  • Flexible Architecture: Combining a Cortex-M3 MCU with an FPGA, the M2S060-FGG676 offers both programmable logic and microcontroller functionality, providing flexibility and adaptability.
  • Extensive Connectivity Options: The SoC supports a wide range of connectivity options, including CANbus, Ethernet, I2C, SPI, UART/USART, and USB, making it suitable for various communication protocols.
  • Advanced Peripherals: Features include DDR, PCIe, and SERDES, enabling high-speed data transfer and advanced peripheral management.
  • Wide Operating Temperature Range: The device operates reliably within a temperature range of 0°C to 85°C (TJ), making it suitable for industrial and automotive applications.
  • Comprehensive I/O Capabilities: With 387 I/O pins, the M2S060-FGG676 offers extensive connectivity options for interfacing with various external devices.
  • Regulatory Compliance: The M2S060-FGG676 is REACH unaffected and RoHS3 compliant, ensuring it meets stringent environmental and safety standards.
  • Packaging and Moisture Sensitivity: The device is packaged in a tray and has a moisture sensitivity level (MSL) of 3 (168 hours), ensuring reliability during manufacturing processes.

M2S060-FGG676 Applications

The M2S060-FGG676 is ideal for a wide range of applications due to its versatile architecture and extensive feature set. Key applications include:

  • Industrial Control Systems: The combination of high-speed processing and programmable logic makes it suitable for complex automation and control systems.
  • Automotive Electronics: The wide operating temperature range and robust performance make it ideal for automotive applications, such as engine control units and advanced driver-assistance systems (ADAS).
  • Communication Infrastructure: The extensive connectivity options and high-speed peripherals make it suitable for networking equipment and communication gateways.
  • Medical Devices: The reliability and compliance with regulatory standards make it a good fit for medical equipment requiring high precision and safety.
  • Consumer Electronics: The flexibility and performance capabilities make it suitable for advanced consumer electronics, such as smart home devices and multimedia systems.

Conclusion of M2S060-FGG676

The M2S060-FGG676 from Microchip Technology's SmartFusion®2 series is a versatile and powerful SoC that offers a unique blend of high-speed processing, extensive memory, and programmable logic. Its wide range of connectivity options and advanced peripherals make it suitable for a variety of demanding applications. The device's compliance with environmental and safety standards ensures its suitability for industrial and automotive applications. With its robust architecture and extensive feature set, the M2S060-FGG676 stands out as a reliable and efficient solution for modern embedded systems.

FAQ

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