Microchip Technology

MCP14700T-E/MF  

Gate Drivers ICs

This electronic device regards Tape & Reel (TR) method as the top priority. This MCP14700T-E/MF packaging method makes it simple and quick to package big quantities of powdered commodities. This MCP14700T-E/MF is produced by this Microchip Technology in order to provide enough products to meet consumers’ demand. The blueprint of this Microchip Technology is to keep pace with the growth of world’s leading level of science and technology. This MCP14700T-E/MF belongs to Gate Drivers ICs category. It’s previous category pertains to Power Management (PMIC). Complete power supply systems can be implemented using Power Management Integrated Circuits (PMICs). It combines several voltage regulators and control circuits onto a single chip. They simplify and cost-effectively manage system power management while reducing component count and board area. This MCP14700T-E/MF is a great fit for embedded processing in a variety of applications. They are includes edge computing, the Internet of Things (IoT), industrial and medical IoT, electric vehicles (EVs), and autonomous cars.

MCP14700T-E/MF Documents

Download datasheets and manufacturer documentation for MCP14700T-E/MF

PCN Assembly/Origin :

Mold Compound Qualification 07/Oct/2014      

Datasheets :

MCP14700      

PCN Packaging :

Packing Changes 10/Oct/2016       Label and Packing Changes 23/Sep/2015      

Environmental Information :

Microchip CA Prop65       Microchip RoHS       Microchip REACH