Microchip Technology

MCP6295T-E/MS  

OP Amps, Buffer Amps ICs

This electronic component uses Tape & Reel (TR) in a way that fits its particular properties. The packaging strategy used for this "MCP6295T-E/MS" is one of the most popular and affordable packaging options for your company. The manufacturer decides to start mass producing this MCP6295T-E/MS. The goal of this Microchip Technology is to give its downstream producers to give original and genuine electrical components. This Microchip Technology belongs to OP Amps, Buffer Amps ICs category and it is a portion of the linear IC chips. A linear integrated circuit is a solid-state analog device. It characterizes by a theoretically infinite number of possible operating states. It operates over a continuous range of input levels. Both radio frequency (RF) and audio frequency (AF) amplifiers use this MCP6295T-E/MS linear integrated circuit. In these applications, the operational amplifier (op amp) is a typical component. The temperature sensor is another typical use for an analog integrated circuit.

MCP6295T-E/MS Documents

Download datasheets and manufacturer documentation for MCP6295T-E/MS

PCN Assembly/Origin :

Bond Wire 29/Nov/2017      

Datasheets :

MCP6291(R)-95~       Analog and Interface Product Guide      

PCN Packaging :

Reel Design Update 07/May/2015       Packing Changes 10/Oct/2016      

Manuals :

Development Tools Catalog      

Design Resources :

MCP6295 Development Tool Selector      

Other Related Documents :

Portable Power Conversion Design Guide      

HTML Datasheet :

MCP6291(R)-95~      

PCN Design/Specification :

Bond Wire Qualification 13/Jun/2016       MCP6291/1R/2/3/4/5 20/Nov/2019      

Environmental Information :

Microchip CA Prop65       Microchip RoHS       Microchip REACH