Microchip Technology

MCP661T-E/MNY  

OP Amps, Buffer Amps ICs

This electronic component uses Tape & Reel (TR) in a way that fits its particular properties. The packaging strategy used for this "MCP661T-E/MNY" is one of the most popular and affordable packaging options for your company. The manufacturer decides to start mass producing this MCP661T-E/MNY. The goal of this Microchip Technology is to give its downstream producers to give original and genuine electrical components. This Microchip Technology belongs to OP Amps, Buffer Amps ICs category and it is a portion of the linear IC chips. A linear integrated circuit is a solid-state analog device. It characterizes by a theoretically infinite number of possible operating states. It operates over a continuous range of input levels. Both radio frequency (RF) and audio frequency (AF) amplifiers use this MCP661T-E/MNY linear integrated circuit. In these applications, the operational amplifier (op amp) is a typical component. The temperature sensor is another typical use for an analog integrated circuit.

MCP661T-E/MNY Documents

Download datasheets and manufacturer documentation for MCP661T-E/MNY

PCN Assembly/Origin :

Assembly Site 22/Nov/2023      

Datasheets :

Analog and Interface Product Guide       MCP660-669      

PCN Packaging :

Packing Changes 10/Oct/2016       Label and Packing Changes 23/Sep/2015      

Design Resources :

MCP661 Development Tool Selector      

HTML Datasheet :

MCP660-669      

PCN Design/Specification :

MCP66 Datasheet Update 14/Aug/2014       Mold Compound Update 18/Feb/2015      

Environmental Information :

Microchip CA Prop65       Microchip RoHS       Microchip REACH