Microchip Technology

MCP98243-BE/MC  

Thermal Management ICs

This electronic device regards Tube method as the top priority. This MCP98243-BE/MC packaging method makes it simple and quick to package big quantities of powdered commodities. This MCP98243-BE/MC is produced by this Microchip Technology in order to provide enough products to meet consumers’ demand. The blueprint of this Microchip Technology is to keep pace with the growth of world’s leading level of science and technology. This MCP98243-BE/MC belongs to Thermal Management ICs category. It’s previous category pertains to Power Management (PMIC). Complete power supply systems can be implemented using Power Management Integrated Circuits (PMICs). It combines several voltage regulators and control circuits onto a single chip. They simplify and cost-effectively manage system power management while reducing component count and board area. This MCP98243-BE/MC is a great fit for embedded processing in a variety of applications. They are includes edge computing, the Internet of Things (IoT), industrial and medical IoT, electric vehicles (EVs), and autonomous cars.

MCP98243-BE/MC Documents

Download datasheets and manufacturer documentation for MCP98243-BE/MC

PCN Assembly/Origin :

Assembly Site 27/Jan/2021      

Datasheets :

MCP98243       Analog and Interface Product Guide      

PCN Packaging :

Packing Changes 10/Oct/2016       Label and Packing Changes 23/Sep/2015      

HTML Datasheet :

MCP98243      

PCN Design/Specification :

Lead Frame Update 29/Jun/2015       Mold Compound Update 18/Feb/2015      

Environmental Information :

Microchip CA Prop65       Microchip RoHS       Microchip REACH