Microchip Technology

MCP9843T-BE/MNY  

Thermal Management ICs

This electronic device regards Tape & Reel (TR) method as the top priority. This MCP9843T-BE/MNY packaging method makes it simple and quick to package big quantities of powdered commodities. This MCP9843T-BE/MNY is produced by this Microchip Technology in order to provide enough products to meet consumers’ demand. The blueprint of this Microchip Technology is to keep pace with the growth of world’s leading level of science and technology. This MCP9843T-BE/MNY belongs to Thermal Management ICs category. It’s previous category pertains to Power Management (PMIC). Complete power supply systems can be implemented using Power Management Integrated Circuits (PMICs). It combines several voltage regulators and control circuits onto a single chip. They simplify and cost-effectively manage system power management while reducing component count and board area. This MCP9843T-BE/MNY is a great fit for embedded processing in a variety of applications. They are includes edge computing, the Internet of Things (IoT), industrial and medical IoT, electric vehicles (EVs), and autonomous cars.

MCP9843T-BE/MNY Documents

Download datasheets and manufacturer documentation for MCP9843T-BE/MNY

PCN Assembly/Origin :

Additional Assembly Site 13/Apr/2021      

Datasheets :

MCP98243       Analog and Interface Product Guide      

PCN Packaging :

Packing Changes 10/Oct/2016       Label and Packing Changes 23/Sep/2015      

PCN Other :

CuPdAu Bond Wire 24/Apr/2015      

HTML Datasheet :

MCP98243      

PCN Design/Specification :

Mold Compound Update 18/Feb/2015       8L TDFN Package 09/Oct/2016      

Environmental Information :

Microchip CA Prop65       Microchip RoHS       Microchip REACH