Microchip Technology

PIC16LF819T-I/SSTSL  

Microcontrollers

The Microchip Technology PIC16LF819T-I/SSTSL is a low-cost, high-performance microcontroller (MCU) that is part of the PIC16LF series. This MCU is designed for a wide range of applications, including industrial control, consumer electronics, and automotive systems.

Description:

The PIC16LF819T-I/SSTSL is a 14-bit flash microcontroller that features a rich set of integrated peripherals and a wide operating voltage range. It is available in a small-outline, surface-mount package (SSTSL) and is designed for use in a variety of applications where space is at a premium.

Features:

1. 14-bit flash memory architecture
2. 8 kB of flash memory for program storage
3. 256 bytes of RAM
4. 8-bit wide instruction set
5. Wide operating voltage range (2.0V to 5.5V)
6. On-chip debug and programming capabilities
7. Low-power sleep modes
8. Internal oscillator with clock frequencies up to 20 MHz
9. Enhanced mid-range core with increased code density and improved performance
10. On-chip peripherals, including a USART, SPI, I2C, and ADC

Applications:

The PIC16LF819T-I/SSTSL is suitable for a wide range of applications, including:

1. Industrial control systems
2. Consumer electronics, such as appliances and toys
3. Automotive systems, such as body control modules and infotainment systems
4. Medical devices, such as monitoring equipment and diagnostic tools
5. Smart home and building automation systems
6. Remote sensing and data acquisition systems
7. Battery-powered devices, thanks to its low-power sleep modes

In summary, the Microchip Technology PIC16LF819T-I/SSTSL is a versatile, low-cost microcontroller with a wide range of features that make it suitable for a variety of applications. Its small form factor, low power consumption, and integrated peripherals make it an attractive choice for designers looking to create compact, efficient, and cost-effective solutions.

PIC16LF819T-I/SSTSL Documents

Download datasheets and manufacturer documentation for PIC16LF819T-I/SSTSL

Errata :

SSP Module Errata      

PCN Assembly/Origin :

Mult Devices Bond Wire 08/Mar/2018      

Datasheets :

PIC16F818, 819      

PCN Packaging :

Packing Changes 10/Oct/2016       Label and Packing Changes 23/Sep/2015      

Design Resources :

PIC16LF819 Development Tool Selector      

HTML Datasheet :

PIC16F818, 819      

Environmental Information :

Microchip CA Prop65       Microchip RoHS       Microchip REACH