Microchip Technology_PIC18F26J53-I/SO

Microchip Technology
PIC18F26J53-I/SO  
Microcontrollers

PIC18F26J53-I/SO
685-PIC18F26J53-I/SO
Ersa
Microchip Technology-PIC18F26J53-I/SO-datasheets-5892163.pdf
IC MCU 8BIT 64KB FLASH 28SOIC
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    PIC18F26J53-I/SO Description

    The PIC18F26J53-I/SO is a microcontroller (MCU) from Microchip Technology's PIC18F26Jxx family. It is a member of the 8-bit PIC18F26J series, which are designed for a wide range of applications, including industrial control, automotive systems, and consumer electronics.

    Description:

    The PIC18F26J53-I/SO is a high-performance, enhanced mid-range MCU with advanced features and peripherals. It is available in a 28-pin, 0.203-inch wide, small-outline integrated circuit (SOIC) package. The device is based on the 8-bit PIC architecture and operates with a maximum clock frequency of 40 MHz.

    Features:

    1. Core: 8-bit, 40 MIPS (million instructions per second) PIC18X core.
    2. Memory:
      • Flash Memory: 128 KB, with read-while-write capability.
      • RAM: 8 KB of general-purpose RAM.
      • EEPROM: 4 KB of EEPROM memory for non-volatile data storage.
    3. Peripherals:
      • UART: Two universal asynchronous receivers/transmitters (UARTs) for serial communication.
      • SPI: One serial peripheral interface (SPI) for high-speed serial communication.
      • I2C: One inter-integrated circuit (I2C) for low-speed serial communication.
      • USB: One USB 2.0 full-speed interface for USB communication.
      • CAN: One high-speed CAN 2.0B controller for automotive and industrial applications.
      • ADC: 10-bit analog-to-digital converter with up to 15 channels.
      • PWM: Up to 5 programmable pulse width modulators (PWMs).
      • CCP: Up to 5 configurable capture/compare/PWM (CCP) modules.
      • Comparators: Two internal comparators with programmable reference voltages.
    4. Clock System: Internal oscillator with precision clock options, including a 7.3728 MHz RC oscillator, a 16 MHz oscillator with PLL for system clock multiplication, and an external oscillator option.
    5. Power Management: Low-power sleep modes and power-saving features.
    6. Security: In-Circuit Serial Programming (ICSP) and In-System Programming (ISP) for secure firmware updates.
    7. Debugging: Background debug mode (BDM) and JTAG interface for debugging and testing.

    Applications:

    The PIC18F26J53-I/SO is suitable for a wide range of applications due to its versatile feature set and high performance. Some common applications include:

    1. Industrial control systems: Motor control, sensor interfacing, and data acquisition.
    2. Automotive systems: Engine control modules, body control modules, and infotainment systems.
    3. Consumer electronics: Smart appliances, gaming peripherals, and home automation systems.
    4. Medical devices: Patient monitoring systems, diagnostic equipment, and portable medical instruments.
    5. Communication systems: Data modems, routers, and network interface cards.
    6. Embedded systems: General-purpose control and automation applications.

    The PIC18F26J53-I/SO's combination of processing power, memory, and peripheral options make it a versatile choice for a variety of embedded systems and applications.

    Tech Specifications

    Program Memory Type
    Maximum Expanded Memory Size
    PPAP
    Data Bus Width (bit)
    Product Status
    SPI
    Analog Comparators
    Automotive
    EEPROM Size
    Supplier Package
    Package / Case
    Instruction Set Architecture
    Core Architecture
    REACH Status
    Family Name
    Maximum Operating Supply Voltage (V)
    Maximum Clock Rate (MHz)
    EU RoHS
    Moisture Sensitivity Level (MSL)
    Operating Temperature
    PWM
    ECCN
    Supplier Temperature Grade
    Mounting Type
    Standard Package Name
    Oscillator Type
    Pin Count
    Mounting
    CAN
    USART
    Lead Shape
    Core Size
    Ethernet
    Connectivity
    Program Memory Size
    Typical Operating Supply Voltage (V)
    HTSUS
    Package
    Data Converters
    Programmability
    Core Processor
    PCB changed
    HTS
    ECCN (US)
    Maximum Power Dissipation (mW)
    Device Core
    Supplier Device Package
    ADC Channels
    Minimum Operating Temperature (°C)
    Maximum Operating Temperature (°C)
    No. of Timers
    Package Height
    Mfr
    I2C
    Voltage - Supply (Vcc/Vdd)
    Interface Type
    RoHS Status
    Maximum CPU Frequency (MHz)
    Speed
    Number of ADCs
    USB
    RAM Size
    Number of I/O
    UART
    Peripherals
    I2S
    Package Length
    ADC Resolution (bit)
    Series
    Watchdog
    Part Status
    Number of I/Os
    Package Width
    Base Product Number
    Minimum Operating Supply Voltage (V)
    Unit Weight
    Product
    ADC Resolution
    RoHS
    Supply Voltage - Min
    Tradename
    Processor Series
    Maximum Clock Frequency
    Height
    Maximum Operating Temperature
    Supply Voltage - Max
    Width
    Data RAM Size
    Core
    Mounting Style
    Data Bus Width
    Minimum Operating Temperature
    Number of Timers/Counters
    Moisture Sensitive
    Length
    Number of ADC Channels
    USHTS

    PIC18F26J53-I/SO Documents

    Download datasheets and manufacturer documentation for PIC18F26J53-I/SO

    Ersa PIC18F47J53 Family Errata/Clarification      
    Ersa Bond Wire 16/Aug/2018      
    Ersa PIC18F47J53 Family      
    Ersa Packing Changes 10/Oct/2016       Label and Packing Changes 23/Sep/2015      
    Ersa PIC18F26J53 Development Tool Selector      
    Ersa Microchip CA Prop65       Microchip RoHS       Microchip REACH      

    Shopping Guide

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