The VSC8582XKS-10 is a high-performance telecom interface IC designed by Microchip Technology, a leading manufacturer in the electronics industry. This interface IC chip is specifically engineered to meet the demanding requirements of modern telecommunications systems. It features a 256-ball BGA package, which is ideal for surface mount applications, ensuring robust and reliable performance in various electronic devices. The VSC8582XKS-10 is classified under the ECCN code 5A002A1 MIC and falls under the HTSUS code 8542.39.0001. It is REACH unaffected, ensuring compliance with environmental regulations and standards.
The VSC8582XKS-10 stands out with its advanced technical specifications and performance benefits. Key features include:
The VSC8582XKS-10 is ideal for a variety of applications within the telecommunications industry. Its robust design and advanced features make it suitable for:
The VSC8582XKS-10 from Microchip Technology is a versatile and high-performance telecom interface IC that offers significant advantages over similar models. Its surface mount technology, moisture sensitivity level of 4 (72 hours), and bulk packaging make it an ideal choice for modern telecom and networking applications. With its active product status and compatibility with other VSC8582 series products, the VSC8582XKS-10 ensures long-term support and scalability. This IC is well-suited for telecom infrastructure, networking equipment, industrial communication systems, and data centers, providing reliable and efficient performance in a variety of demanding environments.
Download datasheets and manufacturer documentation for VSC8582XKS-10