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RFQ

Micron Technology

MT29C1G12MAAJVAMD-5 IT

Name: MT29C1G12MAAJVAMD-5 IT
Brand: Micron Technology
SKU: 774-MT29C1G12MAAJVAMD-5 IT

Manufacturer:

Micron Technology

ERSA Part #:

774-MT29C1G12MAAJVAMD-5 IT

Datasheet:

PDF Datasheet

Description:

IC FLASH NAND LPDDR 1.5G 130MCP

RoHS Status:

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Tech Specifications

Part Status Code

Obsolete

Tape & Reel Qty

1000

Component Density

1.5Gb

I/O Voltage

1.8 VOLTS

Number of Components

Product Status

Obsolete

Supplier Device Package

130-VFBGA (8x9)

Package / Case

130-VFBGA

MT29C1G12MAAJVAMD-5 IT Description

Multi‑Chip Package (MCP)

MT29C1G12MAAJVAMD-5 IT

1Gb NAND Flash + 1Gb LPDDR · 133 MHz · Industrial Temp

BRAND

Micron

Technology

Status: Active · Production

RoHS: Compliant

Halogen Free: Yes

Lead‑Free: Yes

Temperature: -40°C to +85°C (Industrial, IT)

📋 Key Specifications

Part Number	MT29C1G12MAAJVAMD-5 IT
Brand	Micron Technology
Product Type	Multi‑Chip Package (NAND + LPDDR)
NAND Density	1 Gb (128 MB) SLC NAND
LPDDR Density	1 Gb (128 MB) LPDDR SDRAM
NAND Interface	Parallel x8 (legacy) · 20 ns cycle
LPDDR Speed	133 MHz (CL=3) · 266 MT/s
Supply Voltage	VCC = 1.8 V (I/O) · VCCQ = 1.8 V
Package	168‑ball FBGA (12×12 mm) – JVAM
Temp. Range (IT)	-40°C to +85°C · Industrial Grade
NAND Endurance	100,000 Program/Erase cycles (SLC)

⚡ Key Features

▸ Integrated NAND + LPDDR in one package
▸ SLC NAND with 100K endurance
▸ LPDDR – low power 1.8V operation
▸ NAND page size: 2KB + 64B spare
▸ LPDDR burst length: 2, 4, 8
▸ Shared I/O bus for reduced pin count
▸ Hardware data protection (WP#)
▸ Industrial temp range (-40°C to +85°C)

📡 Target Applications

Embedded Systems Industrial Control Automotive (Non‑safety) Medical Devices Telecom / Networking Consumer Electronics

📄 Product Description

The MT29C1G12MAAJVAMD-5 IT is a highly integrated Multi‑Chip Package (MCP) from Micron that combines 1Gb SLC NAND Flash and 1Gb LPDDR SDRAM in a single compact 168‑ball FBGA package. This solution is ideal for space‑constrained designs that require both code execution and non‑volatile data storage.

The NAND interface operates at 20 ns cycle time with 2KB page size, while the LPDDR runs at 133 MHz (266 MT/s) with low 1.8V power. The industrial temperature rating (-40°C to +85°C) ensures reliable performance in harsh environments, making it suitable for automotive, industrial, and medical applications that demand high endurance and data integrity.

📦 Ordering & Compliance

MOQ: 1,000 pcs (Tray / Tape & Reel)

Lead Time: 12–16 weeks

ECCN: EAR99

HTS: 8542.32.0051

SLC NAND Green Package Pb‑Free

FAQ

This is a Multi-Chip Package (MCP) memory device that integrates two different types of memory into a single package: NAND Flash: 1 Gb (organized as 128M x 8) for non-volatile data storage. LPDDR SDRAM: 512 Mb (organized as 32M x 16) for high-speed system memory. The device uses a parallel interface and has a 16-bit data bus width.