MT29C2G24MAAAAKAMD-5 IT
Micron Technology_MT29C2G24MAAAAKAMD-5 IT
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Micron Technology
MT29C2G24MAAAAKAMD-5 IT

774-MT29C2G24MAAAAKAMD-5 IT
PDF Datasheet
IC FLASH RAM 2GBIT PAR 130VFBGA

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Tech Specifications

Clock Frequency
200 MHz
Operating Temperature
-40°C ~ 85°C (TA)
Memory Interface
Parallel
ECCN
3A991B1A
Memory Organization
256M x 8 (NAND), 32M x 32 (LPDRAM)
Mounting Type
Surface Mount
Memory Type
Non-Volatile, Volatile
Product Status
Obsolete
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MT29C2G24MAAAAKAMD-5 IT Description

Multi‑Chip Package (MCP)

MT29C2G24MAAAAKAMD-5 IT

2Gb NAND + 1Gb LPDDR · 200 MHz · 1.8V · Industrial Temp
BRAND
Micron
Technology
Status: Active · Production
RoHS: Compliant
Halogen Free: Yes
Lead‑Free: Yes
Temperature: -40°C to +85°C (Industrial, IT)

📋 Key Specifications

Part Number MT29C2G24MAAAAKAMD-5 IT
Brand Micron Technology
Product Type Multi‑Chip Package (NAND + LPDDR)
Total Density 3 Gb (2 Gb NAND + 1 Gb LPDDR)
NAND Density 2 Gb (256 MB) SLC NAND
LPDDR Density 1 Gb (128 MB) LPDDR SDRAM
Speed Grade 200 MHz · CL=3 (tCK = 5 ns)
Data Rate 400 MT/s
Supply Voltage VCC = 1.8 V ± 0.1 V
Package 168‑ball FBGA (12×12 mm) – KAMD
Temp. Range (IT) -40°C to +85°C · Industrial Grade
NAND Endurance 100,000 Program/Erase cycles (SLC)

⚡ Key Features

  • Integrated NAND + LPDDR in one package
  • SLC NAND for high endurance
  • Low‑power 1.8V operation
  • 200 MHz LPDDR with 400 MT/s
  • Programmable burst length (2, 4, 8)
  • Partial‑array self‑refresh (PASR)
  • Hardware data protection (WP#)
  • Industrial temp range (-40°C to +85°C)

📡 Target Applications

Embedded Systems Industrial Control Automotive (Non‑safety) Medical Devices Telecom / Networking Consumer Electronics

📄 Product Description

The MT29C2G24MAAAAKAMD-5 IT is a 3Gb (2Gb NAND + 1Gb LPDDR) Multi‑Chip Package from Micron, combining high‑endurance SLC NAND Flash with low‑power LPDDR SDRAM in a single compact 168‑ball FBGA package. Operating at 1.8V with a 200 MHz clock and 400 MT/s data rate, this device provides an integrated solution for code execution and non‑volatile storage in space‑constrained embedded systems.

The -5 IT grade specifies an industrial temperature range of -40°C to +85°C, ensuring reliable operation in harsh environments. The SLC NAND technology delivers 100,000 program/erase cycles, making this MCP ideal for applications that demand high data integrity and long‑term reliability, such as industrial control, automotive, and medical equipment.

📦 Ordering & Compliance

MOQ: 1,000 pcs (Tray / Tape & Reel)
Lead Time: 10–12 weeks
ECCN: EAR99
HTS: 8542.32.0051
SLC NAND Green Package Pb‑Free
© 2026 Micron Technology — Specifications subject to change. 📅 Data Sheet Rev. 2.4 🔗 Download PDF

FAQ

What are the basic specifications of the MT29C2G24MAAAAKAMD-5 IT?
The MT29C2G24MAAAAKAMD-5 IT is a Multi-Chip Package (MCP) memory device from Micron that integrates both NAND Flash and Mobile LPDDR SDRAM in a single package. It contains a 2 Gbit (256M x 8) NAND Flash and a 1 Gbit (32M x 32) LPDDR DRAM. The device operates with a parallel interface at a clock frequency of 200 MHz and is housed in a 130-ball VFBGA package measuring 8mm x 9mm.
What is the memory configuration and organization of this device?
What are the power supply and temperature operating ranges?
What is the lifecycle status of this component?
Availability (In Stock : 38443 )
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1+ $20.31085 $20.31
10+ $19.44172 $194.42
30+ $17.93485 $538.05
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