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RFQ

Micron Technology

MT29C2G24MAABAHAKC-5 IT

Name: MT29C2G24MAABAHAKC-5 IT
Brand: Micron Technology
SKU: 774-MT29C2G24MAABAHAKC-5 IT

Manufacturer:

Micron Technology

ERSA Part #:

774-MT29C2G24MAABAHAKC-5 IT

Datasheet:

PDF Datasheet

Description:

IC FLASH RAM 2GBIT PAR 107TFBGA

RoHS Status:

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1-2 days delivery

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365 days guarantee

Responsible quality

Tech Specifications

Clock Frequency

200 MHz

Operating Temperature

-40°C ~ 85°C (TA)

Memory Interface

Parallel

ECCN

3A991B1A

Memory Organization

128M x 16 (NAND), 64M x 16 (LPDRAM)

Mounting Type

Surface Mount

Memory Type

Non-Volatile, Volatile

Product Status

Obsolete

MT29C2G24MAABAHAKC-5 IT Description

Multi‑Chip Package (MCP)

MT29C2G24MAABAHAKC-5 IT

2Gb NAND + 1Gb LPDDR · 200 MHz · 1.8V · Industrial Temp

BRAND

Micron

Technology

Status: Active · Production

RoHS: Compliant

Halogen Free: Yes

Lead‑Free: Yes

Temperature: -40°C to +85°C (Industrial, IT)

📋 Key Specifications

Part Number	MT29C2G24MAABAHAKC-5 IT
Brand	Micron Technology
Product Type	Multi‑Chip Package (NAND + LPDDR)
Total Density	3 Gb (2 Gb NAND + 1 Gb LPDDR)
NAND Density	2 Gb (256 MB) SLC NAND
LPDDR Density	1 Gb (128 MB) LPDDR SDRAM
Speed Grade	200 MHz · CL=3 (tCK = 5 ns)
Data Rate	400 MT/s
Supply Voltage	VCC = 1.8 V ± 0.1 V
Package	168‑ball FBGA (12×12 mm) – AHAKC
Temp. Range (IT)	-40°C to +85°C · Industrial Grade
NAND Endurance	100,000 Program/Erase cycles (SLC)

⚡ Key Features

▸ Integrated NAND + LPDDR in one package
▸ SLC NAND for high endurance
▸ Low‑power 1.8V operation
▸ 200 MHz LPDDR with 400 MT/s
▸ Programmable burst length (2, 4, 8)
▸ Partial‑array self‑refresh (PASR)
▸ Hardware data protection (WP#)
▸ Industrial temp range (-40°C to +85°C)

📡 Target Applications

Embedded Systems Industrial Control Automotive (Non‑safety) Medical Devices Telecom / Networking Consumer Electronics

📄 Product Description

The MT29C2G24MAABAHAKC-5 IT is a 3Gb (2Gb NAND + 1Gb LPDDR) Multi‑Chip Package from Micron, combining high‑endurance SLC NAND Flash with low‑power LPDDR SDRAM in a single compact 168‑ball FBGA package. Operating at 1.8V with a 200 MHz clock and 400 MT/s data rate, this device provides an integrated solution for code execution and non‑volatile storage in space‑constrained embedded systems.

The -5 IT grade specifies an industrial temperature range of -40°C to +85°C, ensuring reliable operation in harsh environments. The SLC NAND technology delivers 100,000 program/erase cycles, making this MCP ideal for applications that demand high data integrity and long‑term reliability, such as industrial control, automotive, and medical equipment.

📦 Ordering & Compliance

MOQ: 1,000 pcs (Tray / Tape & Reel)

Lead Time: 10–12 weeks

ECCN: EAR99

HTS: 8542.32.0051

SLC NAND Green Package Pb‑Free

FAQ

The MT29C2G24MAABAHAKC-5 IT is a Multi-Chip Package (MCP) memory device from Micron that integrates both NAND Flash and Mobile LPDRAM in a single package. It contains a 2 Gbit (128M x 16) NAND Flash and a 1 Gbit (64M x 16) LPDRAM. The device operates with a parallel interface at a clock frequency of 200 MHz and is housed in a 107-ball TFBGA package.