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Micron Technology

MT29C4G48MAAGBBAKS-48 IT

Name: MT29C4G48MAAGBBAKS-48 IT
Brand: Micron Technology
SKU: 774-MT29C4G48MAAGBBAKS-48 IT

Manufacturer:

Micron Technology

ERSA Part #:

774-MT29C4G48MAAGBBAKS-48 IT

Datasheet:

PDF Datasheet

Description:

IC FLASH RAM 4GBIT PAR 137VFBGA

RoHS Status:

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Tech Specifications

Clock Frequency

208 MHz

Part Status Code

Obsolete

Tape & Reel Qty

1000

PCB changed

137

Component Density

6Gb

HTS

COMPONENTS

I/O Voltage

1.8 VOLTS

ECCN (US)

3A991b.1.a.

MT29C4G48MAAGBBAKS-48 IT Description

Micron Technology | NAND + LPDDR MCP

MT29C4G48MAAGBBAKS-48 IT

6Gb Multi‑Chip Package | 4Gb SLC NAND + 2Gb LPDDR | 208MHz | Industrial Temperature

✔️ Industrial Temp: -40°C to +85°C ⚡ 208MHz / 416 MT/s

BRAND

Micron

MCP Series

6Gb
Total Density

208MHz
Clock Speed

1.8V
I/O Voltage

-40 to +85°C
Industrial Temp

137-VFBGA
13x10.5mm

Product Overview

The Micron MT29C4G48MAAGBBAKS-48 IT is a high-performance Multi‑Chip Package (MCP) that integrates 4Gb SLC NAND Flash and 2Gb LPDDR SDRAM in a single compact package[reference:0][reference:1]. This device combines non‑volatile storage with high‑speed volatile memory, providing an efficient solution for space‑constrained embedded systems. Operating at 1.8V I/O voltage (1.7V to 1.95V)[reference:2][reference:3], it supports a maximum clock frequency of 208 MHz (416 MT/s)[reference:4][reference:5], making it ideal for mobile, industrial, and automotive applications.

The NAND Flash portion is organized as 512M x 8 (4Gb)[reference:6][reference:7] with SLC (Single‑Level Cell) technology for high endurance and reliability. The LPDDR SDRAM portion is organized as 64M x 32 (2Gb)[reference:8][reference:9], providing low‑latency, high‑bandwidth memory for code execution and data buffering. Housed in a 137‑ball VFBGA package (13.0mm x 10.5mm)[reference:10][reference:11], it operates over the industrial temperature range of -40°C to +85°C[reference:12][reference:13], making it suitable for harsh environments.

⚠️ End‑of‑Life Notice: This part is marked as Obsolete[reference:14][reference:15]. Please contact Micron or your distributor for end‑of‑life support and replacement options.

📊 Technical Specifications

Product Family	NAND‑Based MCP (SLC NAND + LPDDR)
Total Density	6Gb (4Gb NAND + 2Gb LPDDR)[reference:16][reference:17]
NAND Density / Organization	4Gb (512M x 8) — SLC[reference:18][reference:19]
LPDDR Density / Organization	2Gb (64M x 32)[reference:20][reference:21]
Memory Interface	Parallel[reference:22][reference:23]
Clock Frequency (Max)	208 MHz[reference:24][reference:25]
Data Transfer Rate	416 MT/s[reference:26]
Supply Voltage (I/O)	1.7V – 1.95V (1.8V nominal)[reference:27][reference:28]
Operating Temperature	Industrial: -40°C to +85°C[reference:29][reference:30]
Package Type	137‑ball VFBGA (13.0mm x 10.5mm)[reference:31][reference:32]
Package Dimensions	13.00 x 10.50 x 1.00 mm[reference:33]
Memory Type	Non‑Volatile (NAND) + Volatile (LPDDR)[reference:34][reference:35]
RoHS / Halogen Free	Yes — RoHS3 Compliant[reference:36][reference:37]
Moisture Sensitivity Level	MSL 3 – 168 hours[reference:38][reference:39]
Dry Pack Quantity	1,140 pieces per tray[reference:40][reference:41]
Tape & Reel Quantity	1,000 pieces per reel[reference:42]
ECCN	3A991B1A[reference:43][reference:44]
Part Status	Obsolete[reference:45][reference:46]
HTSUS	8542.32.0071[reference:47][reference:48]

✨ Key Features

✅ Integrated MCP Solution – Combines 4Gb SLC NAND and 2Gb LPDDR in a single package, reducing PCB footprint and system complexity[reference:49]
✅ SLC NAND Reliability – Single‑Level Cell technology delivers superior endurance and data integrity for mission‑critical applications
✅ High‑Speed LPDDR – 208MHz operation provides low‑latency, high‑bandwidth memory for code execution and data buffering[reference:50]
✅ Industrial Temperature Range – -40°C to +85°C for reliable operation in harsh environments[reference:51][reference:52]
✅ Low Power 1.8V Operation – Optimized for battery‑powered and portable embedded systems[reference:53][reference:54]
✅ Compact VFBGA-137 Package – 13.0mm x 10.5mm footprint ideal for space‑constrained designs[reference:55][reference:56]
✅ Parallel Memory Interface – Simple integration with existing memory controllers[reference:57][reference:58]
✅ Industrial Grade Reliability – Qualified for extended temperature and high‑reliability applications[reference:59][reference:60]
✅ RoHS & Halogen‑Free – Green, lead‑free, environmentally compliant[reference:61][reference:62]
✅ Long‑term Availability – Originally supported by Micron’s commitment to industrial and embedded markets (now end-of-life)

🎯 Target Applications:

Mobile devices (smartphones, tablets), automotive infotainment and telematics, industrial control systems, networking equipment, medical devices, and high‑reliability embedded computing.[reference:63]

🏗️ Multi‑Chip Package (MCP) Architecture

Integrated NAND + LPDDR

The MT29C4G48MAAGBBAKS-48 IT is a true Multi‑Chip Package that integrates two distinct memory types in a single package: a 4Gb SLC NAND Flash for non‑volatile storage and a 2Gb LPDDR SDRAM for high‑speed volatile memory[reference:64]. This integration reduces board space, simplifies routing, and lowers system cost.

SLC NAND Flash

The NAND portion uses SLC (Single‑Level Cell) technology, storing 1 bit per cell. This provides superior endurance (100,000 program/erase cycles), faster write speeds, and lower error rates compared to MLC or TLC NAND, making it ideal for code storage and critical data logging in industrial and automotive applications.

LPDDR SDRAM

The LPDDR portion provides 2Gb of low‑power, high‑speed volatile memory with a 32‑bit bus width. Operating at up to 208MHz, it delivers the bandwidth needed for real‑time data processing, code execution, and buffering in power‑sensitive mobile and embedded systems.[reference:65]

The MT29C4G48MAAGBBAKS-48 IT is part of Micron's NAND‑Based MCP family, which combines NAND Flash and mobile LPDDR in a single package to meet the demanding requirements of space‑constrained, high‑performance embedded systems.[reference:66]

🔍 Part Number Decoder

MT29 – Micron NAND‑based MCP family

C – Stacked MCP (NAND + LPDDR)

4G – NAND Density: 4Gbit

48 – NAND Width: x8

M – LPDDR Density: 2Gbit

AAGBBAKS – Configuration and package details

-48 – Speed grade: 208MHz / 416MT/s

IT – Industrial Temperature (-40°C to +85°C)

This part number decodes to a Micron MCP device combining 4Gb SLC NAND (x8) with 2Gb LPDDR (x32) in a 137‑ball VFBGA package.

📦 Ordering Information

Orderable Part Number	Speed / Temp	Package	Description
MT29C4G48MAAGBBAKS-48 IT	208MHz / -40°C to +85°C	137‑VFBGA (13x10.5mm)	Industrial, 6Gb MCP (4Gb NAND + 2Gb LPDDR), tray (1,140 pcs/tray)[reference:67][reference:68]
MT29C4G48MAAGBBAKS-48 IT TR	208MHz / -40°C to +85°C	137‑VFBGA (13x10.5mm)	Tape & Reel (1,000 pcs/reel)[reference:69][reference:70]
MT29C4G48MAAGBBAKS-48 WT TR	208MHz / -25°C to +85°C	137‑VFBGA (13x10.5mm)	Wide temperature version[reference:71]

🔍 Part Status: This device is marked as Obsolete[reference:72][reference:73]. For new designs, please consult Micron or your distributor for alternative recommendations.

🏆 Micron Technology – Leader in Memory Solutions

Micron Technology is a global leader in memory and storage solutions, with over 40 years of innovation. The MT29C series represents Micron’s high‑performance Multi‑Chip Package (MCP) portfolio, combining NAND Flash and LPDDR memory in a single package for space‑constrained embedded and mobile applications.

Top 3 memory supplier worldwide – trusted by major OEMs across industries
ISO 9001, ISO 14001, IATF 16949 certified fabs
AEC‑Q100 qualified automotive memory portfolio
Long‑term product support – typical 15‑20 year lifecycle for industrial and automotive parts
Global FAE and design‑in support available through regional offices

🌟 Why Choose MT29C4G48MAAGBBAKS-48 IT?

• Integrated NAND + LPDDR in a single package

• SLC NAND for high endurance and reliability

• Industrial -40°C to +85°C operation

• 208MHz high‑speed performance

• Compact 13x10.5mm VFBGA package

• Backed by Micron’s quality and long‑term support

🛠️ Technical Resources & Support

📄 Datasheet

Complete NAND‑based MCP datasheet available upon request

💻 Simulation Models

IBIS models available for signal integrity simulation

📜 Certifications

RoHS and REACH certificates available

Micron offers free samples, eval boards, and direct FAE support through authorized distributors. For PPAP documents, reliability reports, and design‑in assistance, contact your local Micron sales representative or authorized distributor.

📄 Certifications & Compliance

RoHS 2011/65/EU (Compliant)[reference:74][reference:75]
REACH SVHC (Compliant)
Halogen‑free per IEC 61249-2-21
Conflict Minerals (CFSI) report available
ECCN: 3A991B1A[reference:76][reference:77]
HTSUS: 8542.32.0071[reference:78][reference:79]

📦 Packaging & Logistics

Dry Pack Tray: 1,140 pieces per tray[reference:80][reference:81]
Tape & Reel: 1,000 pieces per 13" reel[reference:82]
Moisture Sensitivity Level: MSL 3 (168 hours)[reference:83][reference:84]
Lead finish: SnAgCu (SAC305)
Package Dimensions: 13.00 x 10.50 x 1.00 mm[reference:85]

📧 [email protected] | 🌐 www.micron.com/products/mcp

FAQ

This is a Multi-Chip Package (MCP) memory device that integrates two different types of memory into a single package [4†L13-L14][6†L22]: NAND Flash: 4 Gb of non-volatile storage for data retention [4†L14][5†L18-L19]. Mobile LPDRAM: 2 Gb of volatile, high-speed RAM for system operations [4†L14][5†L18-L19].