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Micron Technology

MT29F8G08ABACAWP-IT:C

Name: MT29F8G08ABACAWP-IT:C
Brand: Micron Technology
SKU: 774-MT29F8G08ABACAWP-IT:C
Price: 28.14000 USD
Availability: InStock

Manufacturer:

Micron Technology

ERSA Part #:

774-MT29F8G08ABACAWP-IT:C

Datasheet:

PDF Datasheet

Description:

IC FLASH 8GBIT PARALLEL 48TSOP I

Standard Lead Time:

13 weeks

RoHS Status:

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Tech Specifications

Unit Weight

0.546358 oz

Program Current (mA)

Part Status Code

Production

Programming Voltage (V)

2.7 to 3.6

Product

NAND Flash

PPAP

Operating Current (mA)

Memory Type

Non-Volatile

MT29F8G08ABACAWP-IT:C Description

Micron Technology | NAND Flash

MT29F8G08ABACAWP-IT:C

8Gb SLC NAND Flash | 1G x 8 | Parallel Asynchronous Interface | Industrial Temperature

✔️ Industrial Temp: -40°C to +85°C ⚡ 25ns Random Access

BRAND

Micron

SLC NAND Series

8Gb
Density

1G x8
Organization

25ns
Random Access

3.3V
Vcc

48-TSOP
Package

Product Overview

The Micron MT29F8G08ABACAWP-IT:C is an 8Gb (8,589,934,592 bit) SLC (Single‑Level Cell) NAND Flash memory organized as 1G x 8 bits. Operating from a single 3.3V supply (2.7V – 3.6V), it features a high‑speed parallel asynchronous interface with a 25ns random access time, making it ideal for demanding embedded applications such as industrial control, telecommunications, and automotive systems. The “-IT” suffix denotes industrial temperature range (-40°C to +85°C), and :C indicates the C‑die revision with enhanced endurance and reliability.

This SLC NAND device offers exceptional endurance of 100,000 program/erase cycles and 10‑year data retention at 85°C, outperforming MLC/TLC NAND in mission‑critical applications. It is organized into 1,024 blocks, each containing 64 pages of 4KB plus 218 spare bytes per page (for ECC and metadata). Housed in a standard 48‑pin TSOP I package (WP suffix), it provides a reliable, long‑lifecycle storage solution for code shadowing, data logging, and firmware storage.

📊 Technical Specifications

Density / Organization	8Gb (1G x 8 bits)
Memory Cell	SLC (Single‑Level Cell) – 1 bit per cell
Interface	Parallel asynchronous (multiplexed address/data, 8‑bit I/O)
Access Time (tACC)	25ns max (random read)
Page Size	(4KB + 218 spare) bytes per page
Block Size	64 pages per block (256KB + 13.9KB spare)
Number of Blocks	1,024 blocks
Supply Voltage (Vcc)	2.7V – 3.6V (3.3V nominal)
Operating Temperature	Industrial: -40°C to +85°C
Storage Temperature	-55°C to +125°C
Package Type	48‑pin TSOP I (12×20 mm, 0.5mm pitch) – WP code
Package Dimensions	12 x 20 x 1.0 mm
Endurance	100,000 program/erase cycles (minimum)
Data Retention	10 years @ 85°C
Active Current (Read)	30 mA (typical)
Standby Current	50 µA (typical)
Program Time (Page)	300 µs (typical)
Erase Time (Block)	2 ms (typical)
Command Set	Standard NAND commands (Read ID, Read Page, Program Page, Block Erase, Reset)
RoHS / Halogen Free	Yes – “:C” revision compliant
Moisture Sensitivity Level	MSL 3 (168 hours)
Qualification	Industrial temperature; AEC‑Q100 Grade 2 option available
Part Status	Active – In production

✨ Key Features

✅ High Endurance SLC NAND – 100K program/erase cycles, ideal for frequent firmware updates and data logging
✅ Industrial Temperature Range – -40°C to +85°C for harsh environments (outdoor, automotive, industrial)
✅ Fast Random Access – 25ns access time enables low‑latency code execution
✅ Page Program & Block Erase – 4KB page program, 256KB block erase for flexible data management
✅ Spare Area (218 bytes/page) – Dedicated space for ECC, bad block markers, and metadata
✅ Hardware Data Protection – Program/erase lockout during power transitions
✅ Copy-Back Program Mode – Efficient internal data movement without external buffering
✅ Status Register – Monitors pass/fail status of program/erase operations
✅ JEDEC Standard Footprint – 48‑pin TSOP I, compatible with industry‑standard NAND controllers
✅ Long‑term Availability – Micron’s commitment for industrial and embedded markets (15+ years)
✅ Low Standby Power – 50µA typical, suitable for battery‑backed systems
✅ Read Unique ID – Factory‑programmed identifier for device authentication

🎯 Target Applications:

Industrial PLCs, automotive telematics, medical devices, networking switches/routers, military embedded systems, data loggers, secure boot storage, and FPGA configuration memory.

⚡ Why SLC NAND? The Reliability Advantage

Endurance

SLC: 100,000 P/E cycles
MLC: 3,000 – 10,000 cycles
TLC: 500 – 1,000 cycles

Data Retention

SLC: 10+ years @ 85°C
MLC/TLC: Typically 5‑10 years @ 55°C

Error Rate & ECC

SLC requires minimal ECC (1‑bit per 512 bytes), reducing controller complexity and latency.

The MT29F8G08ABACAWP-IT:C is built on Micron’s proven SLC NAND technology, delivering the highest level of reliability for mission‑critical embedded applications where data integrity cannot be compromised.

📦 Ordering Information & Part Number Decoder

Orderable Part Number	Temperature	Package	Description
MT29F8G08ABACAWP-IT:C	-40°C to +85°C	48‑TSOP I	8Gb SLC NAND, industrial, :C revision, tray
MT29F8G08ABACAWP-IT:C TR	-40°C to +85°C	48‑TSOP I	Tape & Reel (1000 pcs/reel)
MT29F8G08ABACAWP-IT:E	-40°C to +85°C	48‑TSOP I	E‑die revision (contact Micron for details)
MT29F8G08ABACAH4-IT:C	-40°C to +85°C	63‑VFBGA	Same die, BGA package

🔍 Part Number Breakdown (MT29F8G08ABACAWP-IT:C):
• MT29F – Micron NAND Flash family
• 8G – 8Gb density
• 08 – x8 bus width
• ABACA – Specific die configuration (4KB page, 64 pages/block, SLC)
• WP – 48‑pin TSOP I package
• -IT – Industrial temperature range (-40°C to +85°C)
• :C – C‑die revision (enhanced endurance and manufacturing process)

🛠️ Controller Compatibility & ECC Requirements

For SLC NAND, Micron recommends a minimum of 1‑bit ECC per 512 bytes. The spare area (218 bytes per page) provides ample room for ECC parity, bad block tables, and wear‑leveling metadata. The device is compatible with virtually all NAND controllers from major SoC vendors (NXP, TI, STMicroelectronics, Intel, AMD) and FPGA NAND IP cores. Micron provides reference software for bad block management and wear leveling (Flash Translation Layer).

📄 Datasheet & Hardware Guide – Complete electrical and timing specifications

💻 Linux MTD Driver – Supported by kernel’s NAND subsystem

🔌 NAND Programmer Support – Compatible with all major device programmers

🏆 Micron Technology – Leader in NAND Flash

Micron Technology is a global leader in memory and storage solutions, with over 40 years of innovation. The MT29F family represents Micron’s high‑reliability SLC NAND portfolio, widely used in industrial, automotive, and communications applications. Micron’s SLC NAND products are known for superior endurance, data retention, and long‑term supply continuity.

Top 3 NAND Flash supplier worldwide – trusted by major OEMs
AEC‑Q100 qualified automotive grade options (Grade 2/3)
ISO 9001, ISO 14001, IATF 16949 certified fabs
34nm, 25nm, and 1xnm SLC process nodes for optimal density and reliability
Long‑term product commitment – 15‑20 year availability for industrial and automotive

🌟 Why Choose MT29F8G08ABACAWP-IT:C?

• Highest endurance SLC – 100K cycles

• Industrial -40°C to +85°C operation

• 25ns random access – fast enough for XIP

• Standard TSOP package for easy design‑in

• Backed by Micron’s quality and long‑term support

📄 Certifications & Compliance

RoHS 2011/65/EU (Compliant)
REACH SVHC (Compliant)
Halogen‑free per IEC 61249-2-21
Conflict Minerals (CFSI) report available
AEC‑Q100 Grade 2 option available

📦 Packaging & Logistics

Tray: 96 pieces per tray (TSOP I)
Tape & Reel: 1000 pieces per 13" reel
Moisture Sensitivity Level: MSL 3
Lead finish: NiPdAu (green, lead‑free)
Lead time: 8‑10 weeks ARO, stock via distributors

FAQ

The MT29F8G08 provides 8 Gb (1 GB) of storage (four times larger than the 2 Gb version) and uses MLC (Multi-Level Cell) technology. While it is more cost-effective and offers higher density, it has lower endurance (typically 3,000-5,000 program/erase cycles per block) and requires stronger ECC (4-bit per 512 bytes) compared to SLC NAND.