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Micron Technology

MTFC4GACAJCN-1M WT

Name: MTFC4GACAJCN-1M WT
Brand: Micron Technology
SKU: 774-MTFC4GACAJCN-1M WT

Manufacturer:

Micron Technology

ERSA Part #:

774-MTFC4GACAJCN-1M WT

Datasheet:

PDF Datasheet

Description:

IC FLASH 32GBIT MMC 153VFBGA

Standard Lead Time:

16 weeks

RoHS Status:

Why Choose Us?

Professional Platform

B2B & B2C purchasing

Delivery at full speed

1-2 days delivery

Wide variety

Original manufacturers

365 days guarantee

Responsible quality

Tech Specifications

PPAP

Operating Current (mA)

Memory Type

Non-Volatile

Product Status

Obsolete

Automotive

Supplier Package

VFBGA

Chip Density (bit)

32G

Package / Case

153-VFBGA

MTFC4GACAJCN-1M WT Description

Micron Technology | eMMC 5.1

MTFC4GACAJCN-1M WT

4GB eMMC 5.1 Flash | Wide Temperature | High‑Reliability Embedded Storage

✔️ Wide Temp: -25°C to +85°C ⚡ eMMC 5.1 / HS400

BRAND

Micron

Industrial eMMC

4GB
Capacity

5.1
eMMC Standard

HS400
Interface Speed

-25 to +85°C
Wide Temp

153
Ball FBGA

Product Overview

The Micron MTFC4GACAJCN-1M WT is a 4GB embedded MultiMediaCard (eMMC) 5.1 compliant flash memory device, integrating Micron’s reliable 3D NAND with an advanced onboard controller. The “WT” suffix indicates wide temperature operation (-25°C to +85°C), making it ideal for industrial, outdoor, and telecom applications where temperature extremes are common. The “‑1M” denotes the performance grade supporting HS400 interface mode for high‑speed data transfers.

With sequential read speeds up to 280 MB/s and write speeds up to 100 MB/s (typical), this eMMC device delivers fast boot times, quick application loading, and smooth data logging. The integrated controller handles all flash management tasks including wear leveling, bad block management, and hardware ECC, simplifying host design and improving system robustness. This part is a perfect choice for embedded systems requiring cost‑effective, high‑reliability storage in harsh environments.

📊 Technical Specifications

Capacity	4 GB (user area) + boot partitions (2×2MB) + RPMB (4MB) + GP partitions
eMMC Standard	JEDEC eMMC 5.1 compliant (backward compatible with 4.5/5.0)
Interface	8-bit parallel MMC, HS400 (200 MHz DDR), HS200, DDR50, etc.
Performance (Typical)	Seq. Read: 280 MB/s \| Seq. Write: 100 MB/s
Supply Voltage	Vcc (NAND) = 2.7 – 3.6V, Vccq (I/O) = 1.70 – 1.95V or 2.7 – 3.6V
Operating Temperature	Wide Temperature (WT): -25°C to +85°C (case temperature)
Storage Temperature	-40°C to +85°C
Package	153‑ball FBGA (11.5×13.0×1.0 mm), 0.5mm pitch, lead‑free (SnAgCu)
Endurance	3,000 program/erase cycles (typical) – industrial grade
Data Retention	10 years @ 55°C
Power (Active/Sleep)	Active: 200 mW typ. \| Sleep: 1.5 mW \| Deep sleep: 0.3 mW
Features	Boot partitions, RPMB, GP partitions, field firmware update, hardware reset, power‑off notification
Qualification	Industrial wide temperature, optional AEC‑Q100 Grade 3 (contact Micron)
RoHS / Halogen Free	Fully compliant
Moisture Sensitivity Level	MSL 3
Part Status	Active — In production

✨ Key Features

✅ Wide Temperature Range – -25°C to +85°C, ideal for outdoor, industrial, and telematics
✅ HS400 High Speed Interface – up to 280 MB/s read, reduces boot and data access latency
✅ Integrated Controller – advanced wear leveling, bad block management, and 60‑bit ECC
✅ Low Power Consumption – sleep and deep sleep modes extend battery life in portable devices
✅ Partition Flexibility – two boot areas, RPMB for security, and up to four general purpose partitions
✅ Field Firmware Update (FFU) – in‑system updates without storage removal
✅ Enhanced Reliability – hardware ECC, power‑off protection, and data path CRC
✅ JEDEC Standard Footprint – 153‑ball FBGA, compatible with other eMMC modules
✅ Long‑term Availability – Micron commitment for industrial embedded markets (10+ years)

🎯 Target Applications:

Industrial control systems, outdoor surveillance, networking routers/switches, medical monitors, POS terminals, digital signage, IoT gateways, single‑board computers, and telematics units.

⚡ Performance & Power Efficiency

High‑Speed HS400

200 MHz DDR clock yields 280 MB/s sequential read, 100 MB/s sequential write, enabling fast OS boot and file transfers.

Low Power Design

Active power 200 mW; Sleep mode 1.5 mW; Deep sleep 0.3 mW. Ideal for battery‑operated edge devices.

Advanced Flash Management

Dynamic wear leveling, bad block replacement, and 60‑bit BCH ECC ensure long‑term reliability and data integrity.

📦 Ordering Information & Part Number Decoder

Orderable Part Number	Temperature	Package	Description
MTFC4GACAJCN-1M WT	-25°C to +85°C	153‑FBGA	4GB eMMC 5.1, wide temp, HS400
MTFC4GACAJCN-1M WT TR	-25°C to +85°C	153‑FBGA	Tape & Reel (200 pcs/reel)
MTFC8GACAJCN-1M WT	-25°C to +85°C	153‑FBGA	8GB version, same family
MTFC4GACAJCN-1M AIT	-40°C to +105°C	153‑FBGA	Automotive Grade 2 (AEC‑Q100)

🔍 Part Number Breakdown (MTFC4GACAJCN-1M WT):
• MTFC – Micron eMMC Flash family
• 4G – 4 GB density
• ACAJCN – Controller / NAND configuration (3D NAND, specific firmware version)
• -1M – Performance grade supporting HS400 (max 200 MHz DDR)
• WT – Wide Temperature (-25°C to +85°C)

🔒 Reliability & Design Support

📈 Endurance & Retention

3,000 program/erase cycles for industrial applications; 10‑year data retention at 55°C.

🌡️ Temperature Cycling

Qualified per JEDEC JESD22-A104 for 500 cycles (-25°C to +85°C).

💻 Linux & Driver Support

Full MMC subsystem support from kernel 4.14+, including HS400 tuning and command queuing.

Micron provides comprehensive software support: low‑level drivers (Linux, FreeRTOS), bad block management examples, and field firmware update utilities. IBIS models and hardware reference designs are available under NDA.

📄 Compliance & Quality

RoHS 2011/65/EU (Compliant)
REACH SVHC (Compliant)
Halogen‑free per IEC 61249-2-21
Conflict minerals (CFSI) report available

📦 Packaging & Handling

Tray: 160 pieces per tray (standard)
Tape & Reel: 200 pieces per 13” reel
Moisture Sensitivity Level: MSL 3
Lead‑free (SnAgCu) ball finish

FAQ

Answer: Yes. This Micron eMMC is fully RoHS compliant and lead‑free (halogen‑free as well). It meets global environmental regulations for use in consumer, industrial, and medical electronics. The package (153-ball VFBGA) uses lead‑free solder balls compatible with standard lead‑free reflow profiles.