Micron Technology_MTFC4GMWDM-3M AIT
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Micron Technology
MTFC4GMWDM-3M AIT

774-MTFC4GMWDM-3M AIT
IC FLASH 32GBIT MMC 153TFBGA

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Tech Specifications

Operating Temperature
-40°C ~ 85°C (TA)
Memory Interface
MMC
ECCN
3A991B1A
Memory Organization
4G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Obsolete
Supplier Device Package
153-TFBGA (11.5x13)
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MTFC4GMWDM-3M AIT Description

MTFC4GMWDM-3M AIT Description

The MTFC4GMWDM-3M AIT is a high-performance e•MMC™ memory IC chip manufactured by Micron Technology Inc. This device is designed to offer robust and reliable embedded storage solutions. It features a 32Gbit (4GB) memory size, organized as 4G x 8, making it suitable for applications requiring substantial storage capacity in a compact form factor. The memory interface is MMC, ensuring compatibility with a wide range of embedded systems. The chip operates within a voltage supply range of 2.7V to 3.6V, providing flexibility in power management. It is packaged in a 153TFBGA format, ideal for surface mount applications. The MTFC4GMWDM-3M AIT is categorized under Memory IC Chips and is part of the e•MMC™ series, known for its advanced memory management capabilities.

MTFC4GMWDM-3M AIT Features

  • Memory Size and Organization: The MTFC4GMWDM-3M AIT offers a 32Gbit (4GB) memory size, organized as 4G x 8, providing ample storage for embedded systems.
  • Memory Interface: It utilizes the MMC interface, ensuring seamless integration with various embedded platforms.
  • Voltage Range: The device operates within a voltage supply range of 2.7V to 3.6V, offering flexibility in power management.
  • Mounting Type: The surface mount technology (SMT) ensures a compact and reliable installation, suitable for space-constrained applications.
  • Package Type: The 153TFBGA package format is designed for high-density applications, providing a robust and durable solution.
  • Memory Format: The FLASH memory format ensures fast read and write speeds, enhancing overall system performance.
  • ECCN and HTSUS: The MTFC4GMWDM-3M AIT is classified under ECCN 3A991B1A and HTSUS 8542.32.0071, ensuring compliance with international export regulations.
  • REACH Status: The device is REACH unaffected, ensuring compliance with environmental and safety regulations.
  • Manufacturer: Manufactured by Micron Technology Inc., a leading provider of advanced memory solutions, ensuring quality and reliability.

MTFC4GMWDM-3M AIT Applications

The MTFC4GMWDM-3M AIT is ideal for a variety of applications where high-density, reliable storage is required. Some specific use cases include:

  • Consumer Electronics: Ideal for smartphones, tablets, and other portable devices that require substantial storage capacity in a compact form factor.
  • Industrial Systems: Suitable for embedded systems in industrial applications, such as control panels, PLCs, and IoT devices, where reliability and performance are critical.
  • Automotive Electronics: Can be used in infotainment systems, advanced driver assistance systems (ADAS), and other automotive applications requiring robust and reliable storage.
  • Medical Devices: Applicable in medical imaging devices, diagnostic equipment, and other medical applications where data integrity and performance are paramount.

Conclusion of MTFC4GMWDM-3M AIT

The MTFC4GMWDM-3M AIT is a high-performance e•MMC™ memory IC chip that offers a combination of advanced features and reliable performance. Its 32Gbit memory size, MMC interface, and surface mount technology make it an ideal solution for a wide range of applications, from consumer electronics to industrial and automotive systems. Manufactured by Micron Technology Inc., this device ensures quality and reliability, making it a preferred choice for embedded storage solutions. Despite being marked as obsolete, the MTFC4GMWDM-3M AIT remains a robust option for applications requiring high-density, reliable storage.

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