Micron Technology_MTFC64GJDDN-3M WT
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Micron Technology
MTFC64GJDDN-3M WT

774-MTFC64GJDDN-3M WT
IC FLASH 512GBIT MMC 169LFBGA

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Tech Specifications

Operating Temperature
-25°C ~ 85°C (TA)
Memory Interface
MMC
ECCN
3A991B1A
Memory Organization
64G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Obsolete
Supplier Device Package
169-LFBGA (14x18)
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MTFC64GJDDN-3M WT Description

MTFC64GJDDN-3M WT Description

The MTFC64GJDDN-3M WT is an obsolete 512 Gbit e•MMC™ memory IC chip, designed for high-density storage applications. Manufactured by Micron Technology Inc., this device features a 64G x 8 memory organization and utilizes the MMC memory interface. It is packaged in a 169LFBGA format, suitable for surface mount applications. The memory format is FLASH, offering reliable and non-volatile storage. The supply voltage range of 1.65V to 3.6V ensures compatibility with a variety of power supply configurations. The device is REACH unaffected and ROHS3 compliant, adhering to stringent environmental and safety standards. With a moisture sensitivity level (MSL) of 3 (168 hours), it is well-suited for environments with moderate humidity levels.

MTFC64GJDDN-3M WT Features

  • High-Density Storage: The 512 Gbit memory size provides substantial storage capacity, ideal for applications requiring large amounts of data.
  • Wide Voltage Range: The 1.65V to 3.6V supply voltage range ensures compatibility with various power supply configurations, enhancing its versatility.
  • Surface Mount Compatibility: The surface mount mounting type allows for efficient integration into compact and high-density PCB designs.
  • Environmental Compliance: Being REACH unaffected and ROHS3 compliant, the MTFC64GJDDN-3M WT meets industry standards for environmental sustainability and safety.
  • Moisture Resistance: With an MSL of 3 (168 hours), the device is suitable for applications in moderately humid environments, ensuring reliability and longevity.
  • MMC Interface: The MMC memory interface offers a standard and widely supported connection method for memory devices.

MTFC64GJDDN-3M WT Applications

The MTFC64GJDDN-3M WT is ideal for applications that require high-density, non-volatile storage solutions. Its 512 Gbit capacity and MMC interface make it suitable for:

  • Consumer Electronics: Smartphones, tablets, and digital cameras benefit from its high storage capacity and compact form factor.
  • Industrial Systems: Embedded systems and industrial control units can leverage its reliability and wide voltage range.
  • Automotive Applications: Infotainment systems and advanced driver assistance systems (ADAS) can utilize its high-density storage for data logging and software storage.
  • IoT Devices: Smart home devices and IoT gateways can take advantage of its compact size and high storage capacity for firmware and data storage.

Conclusion of MTFC64GJDDN-3M WT

The MTFC64GJDDN-3M WT, despite being obsolete, remains a robust and versatile memory IC chip. Its high-density storage capacity, wide voltage range, and environmental compliance make it a reliable choice for a variety of applications. While newer technologies may offer enhanced performance, the MTFC64GJDDN-3M WT continues to serve as a dependable solution for applications requiring substantial non-volatile storage. Its compatibility with MMC interfaces and surface mount technology ensures seamless integration into existing and new designs.

FAQ

Are there related or alternative parts for MTFC64GJDDN-3M WT?
Yes. Related or alternative parts may be available on this page when relevant product data is provided.
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