Micron Technology Tariff Inquiry

MTFC64GJTDN-3F WT

MTFC64GJTDN-3F WT Description

The MTFC64GJTDN-3F WT is an advanced memory IC chip designed by Micron Technology, a leading provider of semiconductor solutions. This e•MMC™ series device offers a substantial storage capacity of 512 Gbit (64GB) in a compact 169-ball FBGA package, making it suitable for a wide range of applications that require high-density storage solutions. The memory is organized in a 64G x 8 format, ensuring efficient data management and high performance.

This IC chip features a Memory Interface compatible with the MMC standard, providing reliable and fast data transfer capabilities. It operates within a supply voltage range of 2.7V to 3.6V, ensuring compatibility with various power supply systems. The MTFC64GJTDN-3F WT is designed for surface mount applications, making it ideal for modern electronic devices that require compact and reliable memory solutions.

MTFC64GJTDN-3F WT Features

• High-Density Storage: With a memory size of 512 Gbit (64GB), the MTFC64GJTDN-3F WT offers significant storage capacity in a small form factor.
• Efficient Memory Organization: The 64G x 8 memory organization ensures optimal data handling and performance.
• Reliable Interface: The MMC memory interface provides robust and fast data transfer capabilities, essential for high-performance applications.
• Flexible Voltage Range: The device operates within a supply voltage range of 2.7V to 3.6V, ensuring compatibility with a variety of power supply systems.
• Surface Mount Compatibility: Designed for surface mount applications, the MTFC64GJTDN-3F WT is ideal for modern electronic devices that require compact and reliable memory solutions.
• Compliance and Safety: The MTFC64GJTDN-3F WT is RoHS3 compliant, ensuring it meets the highest environmental and safety standards.
• Moisture Sensitivity Level: With an MSL rating of 3 (168 Hours), the device is designed to withstand typical manufacturing and storage conditions.

MTFC64GJTDN-3F WT Applications

The MTFC64GJTDN-3F WT is ideal for a variety of applications that require high-density, reliable, and compact memory solutions. Some specific use cases include:

• Consumer Electronics: Ideal for smartphones, tablets, and other portable devices that require substantial storage capacity in a small form factor.
• Embedded Systems: Suitable for embedded systems in automotive, industrial, and IoT applications where reliable and high-density storage is crucial.
• Wearable Devices: Perfect for wearable technology that demands compact and efficient memory solutions without compromising on storage capacity.
• Medical Devices: Ideal for medical equipment that requires reliable and high-density storage for patient data and device firmware.

Conclusion of MTFC64GJTDN-3F WT

The MTFC64GJTDN-3F WT is a high-performance memory IC chip that offers significant storage capacity in a compact and reliable package. Its 512 Gbit (64GB) storage capacity, MMC memory interface, and surface mount compatibility make it an excellent choice for a wide range of applications, from consumer electronics to industrial and medical devices. Despite being marked as obsolete, the MTFC64GJTDN-3F WT remains a robust and reliable solution for applications that require high-density and efficient memory storage. Its RoHS3 compliance and moisture sensitivity level rating further enhance its suitability for modern manufacturing and storage environments.