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Micron Technology

MTFC8GAKAJCN-1M WT

Name: MTFC8GAKAJCN-1M WT
Brand: Micron Technology
SKU: 774-MTFC8GAKAJCN-1M WT
Price: 26.15143 USD
Availability: InStock

Manufacturer:

Micron Technology

ERSA Part #:

774-MTFC8GAKAJCN-1M WT

Datasheet:

PDF Datasheet

Description:

IC FLASH 64GBIT MMC 153VFBGA

RoHS Status:

Why Choose Us?

Professional Platform

B2B & B2C purchasing

Delivery at full speed

1-2 days delivery

Wide variety

Original manufacturers

365 days guarantee

Responsible quality

Tech Specifications

Part Status Code

Obsolete

Tape & Reel Qty

1000

Component Density

64Gb

I/O Voltage

3.3 VOLTS

Number of Components

Memory Type

Non-Volatile

Product Status

Obsolete

Supplier Device Package

153-VFBGA (11.5x13)

MTFC8GAKAJCN-1M WT Description

Micron Technology | eMMC 5.1

MTFC8GAKAJCN-1M WT

8GB eMMC 5.1 Flash | Wide Temperature | High‑Reliability Embedded Storage

✔️ Wide Temp: -25°C to +85°C ⚡ eMMC 5.1 / HS400

BRAND

Micron

Industrial eMMC

8GB
Capacity

5.1
eMMC Standard

HS400
Interface Speed

-25 to +85°C
Wide Temp

153
Ball FBGA

Product Overview

The Micron MTFC8GAKAJCN-1M WT is an 8GB embedded MultiMediaCard (eMMC) 5.1 compliant storage solution, integrating Micron’s reliable 3D NAND with a powerful onboard controller. The “WT” suffix indicates wide temperature operation (-25°C to +85°C), making it ideal for industrial and outdoor applications where temperature extremes are common. The “‑1M” denotes the performance grade supporting HS400 interface mode for high‑speed data transfers.

With sequential read speeds up to 280 MB/s and write speeds up to 120 MB/s (typical), this eMMC device delivers fast boot times, quick application loading, and smooth data logging. The integrated controller handles all flash management tasks including wear leveling, bad block management, and hardware ECC, simplifying host design and improving system robustness. This part is a perfect choice for embedded systems requiring cost‑effective, high‑reliability storage in harsh environments.

📊 Technical Specifications

Capacity	8 GB (user area) + boot partitions (2×2MB) + RPMB (4MB) + GP partitions
eMMC Standard	JEDEC eMMC 5.1 compliant (backward compatible with 4.5/5.0)
Interface	8-bit parallel MMC, HS400 (200 MHz DDR), HS200, DDR50, etc.
Performance (Typical)	Seq. Read: 280 MB/s \| Seq. Write: 120 MB/s
Supply Voltage	Vcc (NAND) = 2.7 – 3.6V, Vccq (I/O) = 1.70 – 1.95V or 2.7 – 3.6V
Operating Temperature	Wide Temperature (WT): -25°C to +85°C (case temperature)
Storage Temperature	-40°C to +85°C
Package	153‑ball FBGA (11.5×13.0×1.0 mm), 0.5mm pitch, lead‑free (SnAgCu)
Endurance	3,000 program/erase cycles (typical) – industrial grade
Data Retention	10 years @ 55°C
Power (Active/Sleep)	Active: 250 mW typ. \| Sleep: 1.5 mW \| Deep sleep: 0.3 mW
Features	Boot partitions, RPMB, GP partitions, field firmware update, hardware reset, power‑off notification
Qualification	Industrial wide temperature, optional AEC‑Q100 Grade 3 (contact Micron)
RoHS / Halogen Free	Fully compliant

✨ Key Features

✅ Wide Temperature Range – -25°C to +85°C, ideal for outdoor, industrial, and telematics
✅ HS400 High Speed Interface – up to 280 MB/s read, reduces boot and data access latency
✅ Integrated Controller – advanced wear leveling, bad block management, and 60‑bit ECC
✅ Low Power Consumption – sleep and deep sleep modes extend battery life in portable devices
✅ Partition Flexibility – two boot areas, RPMB for security, and up to four general purpose partitions
✅ Field Firmware Update (FFU) – in‑system updates without storage removal
✅ Enhanced Reliability – hardware ECC, power‑off protection, and data path CRC
✅ JEDEC Standard Footprint – 153‑ball FBGA, compatible with other eMMC modules
✅ Long‑term Availability – Micron commitment for industrial embedded markets (10+ years)

🎯 Target Applications:

Industrial control systems, outdoor surveillance, networking routers/switches, medical monitors, POS terminals, digital signage, IoT gateways, single‑board computers, and telematics units.

📦 Ordering Information & Part Number Decoder

Orderable Part Number	Temperature	Package	Description
MTFC8GAKAJCN-1M WT	-25°C to +85°C	153‑FBGA	8GB eMMC 5.1, wide temp, HS400
MTFC8GAKAJCN-1M WT TR	-25°C to +85°C	153‑FBGA	Tape & Reel (200 pcs/reel)
MTFC16GAKAJCN-1M WT	-25°C to +85°C	153‑FBGA	16GB version, same family
MTFC8GAKAJCN-1M AIT	-40°C to +105°C	153‑FBGA	Automotive Grade 2 (AEC‑Q100)

🔍 Part Number Breakdown (MTFC8GAKAJCN-1M WT):
• MTFC – Micron eMMC Flash family
• 8G – 8 GB density
• AKAJCN – Controller / NAND configuration (3D NAND, specific firmware version)
• -1M – Performance grade supporting HS400 (max 200 MHz DDR)
• WT – Wide Temperature (-25°C to +85°C)

🌡️ Designed for Harsh Environments

✅ Wide Temperature Compliance

Tested for -25°C to +85°C operation, with additional margin for industrial use.

✅ High Shock & Vibration Resistance

Meets JEDEC JESD22‑B104 and MIL‑STD‑883 standards, suitable for mobile and outdoor equipment.

✅ Enhanced Data Integrity

60‑bit ECC per 1KB, dynamic data refresh, and end‑to‑end data path protection.

🛠️ Software & Integration Support

The MTFC8GAKAJCN-1M WT is widely supported across embedded operating systems and SoC platforms:

Linux (kernel 4.4+) – native MMC block driver with HS400 tuning support
Windows Embedded Compact / IoT
FreeRTOS, Zephyr, and other RTOS with MMC stack
Micron provides tuning guides, initialization code examples, and field firmware update utilities

📄 Full Datasheet (Rev. 2.0) – electrical, timing, and register description

💻 Linux MMC Tuning Guide – includes HS400 calibration

🔄 FFU Tool & User Manual – secure in‑field updates

📄 Compliance & Quality

RoHS 2011/65/EU (including exemption 7c‑I)
REACH (SVHC list compliant)
Halogen‑free per IEC 61249-2-21
Conflict minerals reporting available

📦 Packaging & Handling

Tray: 160 pieces per tray (standard)
Tape & Reel: 200 pieces per 13” reel
MSL Level 3 (per J‑STD‑020)
Lead‑free (SnAgCu) ball finish

FAQ

This device offers 8 GB of NAND flash memory with an integrated eMMC controller. The usable user capacity is approximately 7.28 GiB after format overhead, boot partitions, and RPMB.