Microsemi_A3P250L-1FGG256I
original

Microsemi
A3P250L-1FGG256I

696-A3P250L-1FGG256I
PDF Datasheet
IC FPGA 157 I/O 256FBGA

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Tech Specifications

Package/Case
FBGA
Height
1.2mm
Length
17mm
Max Frequency
892.86MHz
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Supply Voltage
1.26V
Min Supply Voltage
1.14V
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A3P250L-1FGG256I Description

Microsemi's A3P250L-1FGG256I is a high-performance, low-power, and highly integrated FPGA (Field Programmable Gate Array) device. It belongs to the PolarFire family of FPGAs, which are designed to provide exceptional performance and power efficiency for a wide range of applications.

Description:

The A3P250L-1FGG256I is a mid-range FPGA that offers a balance between performance, power consumption, and cost. It features a compact 256-ball fine-pitch ball grid array (FBGA) package, making it suitable for applications with space constraints. The device has a total of 250,000 logic elements (LEs) and 1,024 embedded memory blocks, providing ample resources for complex designs.

Features:

  1. Low Power Consumption: The PolarFire FPGAs are designed with a focus on low power consumption, making them ideal for battery-powered or energy-sensitive applications.
  2. High Performance: The A3P250L-1FGG256I offers high-performance capabilities with its advanced 12 nm FinFET technology, enabling faster processing and improved system performance.
  3. Security Features: The device includes advanced security features, such as hardware-based encryption and secure boot, to protect intellectual property and ensure data integrity.
  4. Integrated Memory: The FPGA comes with 1,024 embedded memory blocks, providing ample resources for complex designs and reducing the need for external memory components.
  5. High I/O Count: The A3P250L-1FGG256I has a high I/O count, supporting a wide range of peripherals and interfaces.
  6. Configuration and Debugging: The device supports JTAG and SPI configuration interfaces, as well as advanced debugging features, making it easier to develop and debug designs.

Applications:

The A3P250L-1FGG256I is suitable for a wide range of applications, including:

  1. Industrial Automation: The FPGA's low power consumption and high performance make it ideal for industrial control systems and automation equipment.
  2. Communication Systems: The device's high I/O count and support for various communication protocols make it suitable for communication systems, such as base stations and routers.
  3. Automotive: The A3P250L-1FGG256I can be used in various automotive applications, such as infotainment systems, advanced driver assistance systems (ADAS), and powertrain control.
  4. Aerospace and Defense: The FPGA's security features and high reliability make it suitable for aerospace and defense applications, such as satellite communication systems and radar processing.
  5. Medical Electronics: The device's compact form factor and low power consumption make it suitable for medical electronics, such as imaging systems and patient monitoring devices.
  6. Consumer Electronics: The A3P250L-1FGG256I can be used in consumer electronics, such as smart home devices, wearables, and IoT applications.

FAQ

Does A3P250L-1FGG256I have quantity-based pricing?
Yes. A3P250L-1FGG256I currently has 1 pricing tier(s), starting from 90 units.
What operating temperature range does A3P250L-1FGG256I support?
Are there related or alternative parts for A3P250L-1FGG256I?
What package or case is A3P250L-1FGG256I available in?
What voltage specification is listed for A3P250L-1FGG256I?
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