Microsemi_M2GL100TS-1FCG1152I
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Microsemi
M2GL100TS-1FCG1152I

696-M2GL100TS-1FCG1152I
PDF Datasheet
IC FPGA 574 I/O 1152FCBGA

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
3637248
ECCN
5A002A1
Number of I/O
574
Mounting Type
Surface Mount
Product Status
Obsolete
Supplier Device Package
1152-FCBGA (35x35)
Series
IGLOO2
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M2GL100TS-1FCG1152I Description

Microsemi's M2GL100TS-1FCG1152I is a high-performance, low-power, and high-density SRAM (Static Random Access Memory) module designed for a wide range of applications in various industries. This module offers a combination of high-speed access, low power consumption, and high reliability, making it an ideal choice for demanding applications.

Description:

The M2GL100TS-1FCG1152I is a 100MHz synchronous SRAM module with a 1Gb (Gigabit) memory capacity, organized as 512M words x 32 bits. It features a 3.3V power supply and operates at a maximum frequency of 100MHz. The module is available in a 1152-ball FCBGA (Fine-Pitch Ball Grid Array) package, making it suitable for high-density applications.

Features:

  1. High memory capacity: With 1Gb of memory, the M2GL100TS-1FCG1152I provides ample storage for data-intensive applications.
  2. High-speed operation: The module operates at a maximum frequency of 100MHz, ensuring fast access to stored data.
  3. Low power consumption: Designed for low power applications, the M2GL100TS-1FCG1152I consumes minimal power, making it suitable for energy-efficient systems.
  4. High reliability: Built with high-quality materials and advanced manufacturing processes, this SRAM module offers high reliability and long-term performance.
  5. 3.3V power supply: The module operates on a 3.3V power supply, which is compatible with a wide range of electronic systems.
  6. 1152-ball FCBGA package: The compact package allows for high-density integration in various applications.

Applications:

The M2GL100TS-1FCG1152I is suitable for a wide range of applications, including but not limited to:

  1. Industrial control systems: The high-speed access and low power consumption make it ideal for real-time control systems in industrial environments.
  2. Networking equipment: The module's high reliability and high-speed performance are essential for networking equipment, such as routers and switches.
  3. Consumer electronics: The M2GL100TS-1FCG1152I can be used in various consumer electronics, such as gaming consoles, set-top boxes, and smart TVs.
  4. Automotive systems: The module's high reliability and low power consumption make it suitable for use in automotive applications, such as infotainment systems and advanced driver assistance systems (ADAS).
  5. Aerospace and defense: The M2GL100TS-1FCG1152I can be used in aerospace and defense applications, where high reliability and performance are critical.

In summary, Microsemi's M2GL100TS-1FCG1152I is a high-performance, low-power, and high-density SRAM module that offers a combination of high-speed access, low power consumption, and high reliability. Its wide range of applications makes it an ideal choice for various industries, including industrial control systems, networking equipment, consumer electronics, automotive systems, and aerospace and defense.

FAQ

Does M2GL100TS-1FCG1152I have quantity-based pricing?
Yes. M2GL100TS-1FCG1152I currently has 1 pricing tier(s), starting from 24 units.
What is M2GL100TS-1FCG1152I?
What operating temperature range does M2GL100TS-1FCG1152I support?
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