NXP Semiconductors Tariff Inquiry

74LVC125AD/AU118

74LVC125AD/AU118 Description

The 74LVC125AD/AU118 is a bus driver IC from the 74LVC series, manufactured by NXP Semiconductors. This logic IC chip is designed to provide efficient and reliable signal buffering and driving capabilities in various electronic systems. It features four elements, each with one bit per element, making it suitable for applications requiring multiple signal paths.

74LVC125AD/AU118 Features

• Series: 74LVC
• Number of Elements: 4
• Number of Bits per Element: 1
• Voltage - Supply: 1.2V to 3.6V, offering wide voltage range compatibility
• Current - Output High, Low: 24mA, 24mA, ensuring robust signal drive capabilities
• Mounting Type: Surface Mount, ideal for compact and high-density PCB designs
• Moisture Sensitivity Level (MSL): 3 (168 Hours), suitable for standard manufacturing processes
• Package: Bulk, allowing for cost-effective and flexible procurement
• ECCN: EAR99, indicating compliance with export regulations
• HTSUS: 8542.39.0001, facilitating accurate tariff classification
• REACH Status: Vendor Undefined
• RoHS Status: Not applicable
• Manufacturer: NXP USA Inc.
• Base Product Number: 74LVC125

74LVC125AD/AU118 Applications

The 74LVC125AD/AU118 is well-suited for a variety of applications where reliable signal buffering and driving are essential. Its wide supply voltage range and robust output current capabilities make it ideal for:

• Data Bus Applications: Enhancing signal integrity and drive strength in data buses
• Microcontroller Interfaces: Facilitating communication between microcontrollers and peripheral devices
• Memory Interfaces: Driving signals to and from memory modules, ensuring reliable data transfer
• General Logic Buffering: Providing buffering for general-purpose logic signals in various electronic systems

Conclusion of 74LVC125AD/AU118

The 74LVC125AD/AU118 is a versatile and reliable bus driver IC that offers significant performance benefits due to its wide supply voltage range and robust output current capabilities. Its surface mount packaging and compatibility with standard manufacturing processes make it suitable for a wide range of applications. While it is currently marked as obsolete, it remains a valuable component for legacy systems and applications where its unique features and performance advantages are still relevant.