NXP Semiconductors_AFSC5G37E38T2
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NXP Semiconductors
AFSC5G37E38T2

860-AFSC5G37E38T2
PDF Datasheet
AFSC5G37E38 - Airfast Power Ampl
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Tech Specifications

Number of Channels per Chip
1
Power Supply Type
Single
PCB changed
26
HTS
8542.33.00.01
Typical Gain Flatness (dB)
0.3
Typical Power Gain (dB)
28.3@3700MHz
ECCN (US)
EAR99
Typical Output Power (dBm)
45.5@3700MHz
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AFSC5G37E38T2 Description

With a vision to drive innovation and transform industries, the Bulk in this AFSC5G37E38T2 plays a crucial role in enabling the Internet of Things (IoT), smart cities, autonomous vehicles, and more. NXP Semiconductors is the manufacturer of this electronic component and is committed to creating high-performance chips to meet consumer demands effectively. RF and Wireless is a cutting-edge technology package that revolutionizes the way we communicate and connect in today's digital world. This NXP Semiconductors AFSC5G37E38T2 falls into the RF Amplifiers which is a subset of RF and Wireless. This AFSC5G37E38T2 ‘s applications are vast and diverse, spanning telecommunications, healthcare, transportation, manufacturing, and beyond. By leveraging RF and Wireless technology, products can achieve greater efficiency, reliability, and convenience, ultimately enhancing the overall user experience.

FAQ

What package or case is AFSC5G37E38T2 available in?
AFSC5G37E38T2 is available in the 26-LQFN Exposed Pad package / case.
What is AFSC5G37E38T2?
What operating temperature range does AFSC5G37E38T2 support?
Is AFSC5G37E38T2 currently in stock?
What is the mounting type of AFSC5G37E38T2?
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