NXP Semiconductors_BGA2011,115
original

NXP Semiconductors
BGA2011,115

860-BGA2011,115
PDF Datasheet
IC RF AMP CDMA 900MHZ 6TSSOP

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Tech Specifications

ECCN
EAR99
Mounting Type
Surface Mount
Current - Supply
10mA ~ 20mA
Product Status
Obsolete
Supplier Device Package
6-TSSOP
Series
-
Package / Case
6-TSSOP, SC-88, SOT-363
Voltage - Supply
4.5V
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BGA2011,115 Description

With a vision to drive innovation and transform industries, the Tape & Reel (TR) in this BGA2011,115 plays a crucial role in enabling the Internet of Things (IoT), smart cities, autonomous vehicles, and more. NXP Semiconductors is the manufacturer of this electronic component and is committed to creating high-performance chips to meet consumer demands effectively. RF and Wireless is a cutting-edge technology package that revolutionizes the way we communicate and connect in today's digital world. This NXP Semiconductors BGA2011,115 falls into the RF Amplifiers which is a subset of RF and Wireless. This BGA2011,115 ‘s applications are vast and diverse, spanning telecommunications, healthcare, transportation, manufacturing, and beyond. By leveraging RF and Wireless technology, products can achieve greater efficiency, reliability, and convenience, ultimately enhancing the overall user experience.

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