NXP Semiconductors_BGS8M2X
original

NXP Semiconductors
BGS8M2X

860-BGS8M2X
PDF Datasheet
IC RF AMP 1.8GHZ-2.2GHZ 6XSON
13 Weeks

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Tech Specifications

ECCN
EAR99
Mounting Type
Surface Mount
Current - Supply
5.8mA
Product Status
Active
Supplier Device Package
6-XSON (1.1x0.7)
Series
BGS8M2
Package / Case
6-XFDFN
Voltage - Supply
1.5V ~ 3.1V
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BGS8M2X Description

With a vision to drive innovation and transform industries, the Tape & Reel (TR) in this BGS8M2X plays a crucial role in enabling the Internet of Things (IoT), smart cities, autonomous vehicles, and more. NXP Semiconductors is the manufacturer of this electronic component and is committed to creating high-performance chips to meet consumer demands effectively. RF and Wireless is a cutting-edge technology package that revolutionizes the way we communicate and connect in today's digital world. This NXP Semiconductors BGS8M2X falls into the RF Amplifiers which is a subset of RF and Wireless. This BGS8M2X ‘s applications are vast and diverse, spanning telecommunications, healthcare, transportation, manufacturing, and beyond. By leveraging RF and Wireless technology, products can achieve greater efficiency, reliability, and convenience, ultimately enhancing the overall user experience.

FAQ

What operating temperature range does BGS8M2X support?
BGS8M2X has an operating temperature range of + 85 C.
What package or case is BGS8M2X available in?
What is BGS8M2X?
What is the standard lead time for BGS8M2X?
What voltage specification is listed for BGS8M2X?
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