NXP Semiconductors_LPC2364FBD100K

NXP Semiconductors
LPC2364FBD100K  
Microcontrollers

NXP Semiconductors
LPC2364FBD100K
685-LPC2364FBD100K
Ersa
NXP Semiconductors-LPC2364FBD100K-datasheets-13357049.pdf
IC MCU 16/32B 128KB FLSH 100LQFP
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LPC2364FBD100K Description

The LPC2364FBD100K is a high-performance microcontroller unit (MCU) manufactured by NXP Semiconductors. It is based on the ARM7TDMI-S processor and operates at a clock speed of up to 72 MHz. The device is designed for a wide range of applications, including industrial control, medical equipment, and consumer electronics.

Description:

The LPC2364FBD100K is a 100-pin QFP (Quad Flat Package) package microcontroller with 512KB of on-chip flash memory, 64KB of static RAM (SRAM), and 16KB of data EEPROM. It also features a range of communication interfaces, including USB, Ethernet, and CAN, making it suitable for a variety of embedded applications.

Features:

  1. ARM7TDMI-S processor with a clock speed of up to 72 MHz
  2. 512KB on-chip flash memory
  3. 64KB static RAM (SRAM)
  4. 16KB data EEPROM
  5. USB, Ethernet, and CAN communication interfaces
  6. Advanced peripherals, including UART, SPI, and I2C
  7. Real-time clock (RTC) with calendar
  8. 10-bit ADC with up to 8 channels
  9. Flexible power management features
  10. On-chip debugging and trace capabilities

Applications:

  1. Industrial control systems
  2. Medical equipment
  3. Consumer electronics
  4. Automotive infotainment systems
  5. Networking and communication devices
  6. Home automation and security systems
  7. Point-of-sale (POS) terminals
  8. Gaming and entertainment systems
  9. Data acquisition and signal processing systems
  10. Embedded systems requiring high performance and advanced connectivity options.

The LPC2364FBD100K's combination of processing power, memory, and communication interfaces make it a versatile and powerful choice for a wide range of embedded applications. Its advanced peripherals and power management features also contribute to its suitability for energy-efficient and cost-effective solutions.

Tech Specifications

Program Memory Type
Maximum Expanded Memory Size
PPAP
Data Bus Width (bit)
Product Status
SPI
Automotive
Special Features
RoHS
EEPROM Size
Supplier Package
Package / Case
Instruction Set Architecture
Core Architecture
REACH Status
Family Name
Maximum Operating Supply Voltage (V)
Maximum Clock Rate (MHz)
EU RoHS
Moisture Sensitivity Level (MSL)
Operating Temperature
ECCN
Mounting Type
DAC Channels
Standard Package Name
Oscillator Type
Pin Count
Mounting
CAN
USART
Moisture Sensitive
Core Size
Ethernet
Connectivity
SVHC
Program Memory Size
Typical Operating Supply Voltage (V)
HTSUS
Package
Data Converters
Number of DACs
USHTS
Programmability
Core Processor
PCB changed
HTS
ECCN (US)
DAC Resolution (bit)
Maximum Power Dissipation (mW)
Device Core
Supplier Device Package
ADC Channels
Minimum Operating Temperature (°C)
Maximum Operating Temperature (°C)
No. of Timers
Package Height
Mfr
I2C
Voltage - Supply (Vcc/Vdd)
Interface Type
RoHS Status
Maximum CPU Frequency (MHz)
Speed
Number of ADCs
USB
RAM Size
Number of I/O
UART
Peripherals
I2S
Package Length
ADC Resolution (bit)
Series
Part Status
Number of I/Os
Package Width
Base Product Number
Minimum Operating Supply Voltage (V)
Status
IOH
SCTimer / PWM
Safe Assure Functional Safety
Product category
PbFree
Halogen Free
RHF Indicator
Temperature range

LPC2364FBD100K Documents

Download datasheets and manufacturer documentation for LPC2364FBD100K

Ersa LPC2364-68      
Ersa LPCx/PRH601HLx/PXAH30KFBEx 01/Jun/2022       Mult Dev Pkg Seal 15/Dec/2020      
Ersa LPC2364-68      
Ersa NXP USA Inc REACH       NXP USA Inc RoHS Cert      

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