NXP Semiconductors

LPC4337JBD144E  

Microcontrollers

The LPC4337JBD144E is a microcontroller unit (MCU) developed by NXP Semiconductors. It is a part of the LPC4300 series of MCUs, which are based on the ARM Cortex-M4 processor. The LPC4337JBD144E is a high-performance, low-power device that is designed for a wide range of applications.

Description:

The LPC4337JBD144E is a 144-pin QFN package MCU that features a 180 MHz Cortex-M4 CPU with a floating-point unit (FPU). It has 2 MB of on-chip flash memory and 512 KB of SRAM. The device also includes a range of peripheral interfaces, including USB, Ethernet, and various communication interfaces such as UART, SPI, and I2C.

Features:

1. ARM Cortex-M4 CPU with FPU running at 180 MHz
2. 2 MB on-chip flash memory
3. 512 KB SRAM
4. 144-pin QFN package
5. USB OTG interface
6. 10/100 Ethernet interface
7. Advanced control timer (ACT) for motor control applications
8. Multiple communication interfaces: UART, SPI, I2C, CAN, and LIN
9. High-resolution 12-bit ADC with up to 8 channels
10. Flexible clock management system
11. Integrated memory controller supporting external memory devices
12. Rich set of timers and event counters

Applications:

The LPC4337JBD144E is suitable for a wide range of applications due to its high performance, low power consumption, and extensive peripheral set. Some potential applications include:

1. Industrial control systems
2. Motor control applications
3. Medical equipment
4. Robotics
5. Consumer electronics
6. Automotive infotainment systems
7. Networking and communication devices
8. IoT devices and gateways
9. Smart home appliances
10. Wearable devices

The LPC4337JBD144E's combination of processing power, memory, and peripheral interfaces makes it a versatile choice for embedded systems designers looking to develop high-performance, low-power applications.

LPC4337JBD144E Documents

Download datasheets and manufacturer documentation for LPC4337JBD144E

PCN Assembly/Origin :

Mult Dev Assembly CHg 20/Dec/2018      

Datasheets :

LPC435x,3x,2x,1x Datasheet      

PCN Packaging :

All Dev Label Update 15/Dec/2020       Mult Dev Pkg Seal 15/Dec/2020      

PCN Design/Specification :

Multiple Design Changes 28/Sep/2014       Datasheet Update 18/Apr/2015      

Environmental Information :

NXP USA Inc REACH       NXP USA Inc RoHS Cert