NXP Semiconductors

MC32PF3001A7EPR2  

Specialized Power Management

MC32PF3001A7EPR2 Description

The MC32PF3001A7EPR2 from NXP Semiconductors is a highly integrated power management IC (PMIC) designed specifically for i.MX7 processors. It operates within a 2.8V to 5.5V supply range, making it suitable for a variety of low-power and battery-powered applications. Packaged in a 48-pin QFN and delivered in Tape & Reel (TR) format, this RoHS3-compliant and REACH-unaffected device is ideal for surface-mount designs. With a Moisture Sensitivity Level (MSL) of 3 (168 hours), it ensures reliability in humid environments.

MC32PF3001A7EPR2 Features

• 6 Integrated LDOs: Provides stable, low-noise power rails for sensitive analog and digital circuits.
• Wide Input Voltage Range (2.8V–5.5V): Supports flexible power sources, including Li-ion batteries and regulated supplies.
• Optimized for i.MX7 Processors: Delivers tailored power sequencing and efficiency for embedded computing.
• Compact QFN-48 Package: Saves board space while ensuring thermal performance.
• RoHS3 & REACH Compliant: Meets stringent environmental and safety standards.
• Active Product Status: Guaranteed long-term availability and support from NXP.

MC32PF3001A7EPR2 Applications

This PMIC is ideal for:

• Embedded Systems: Power management for i.MX7-based industrial controllers, IoT gateways, and edge devices.
• Portable Electronics: Battery-powered applications requiring efficient multi-rail power delivery.
• Automotive Infotainment: Reliable operation in harsh environments with wide input voltage tolerance.
• Medical Devices: Low-noise power for precision analog circuits in portable diagnostics.

Conclusion of MC32PF3001A7EPR2

The MC32PF3001A7EPR2 stands out for its processor-optimized design, high integration (6 LDOs), and robust environmental compliance. Its versatility in portable, embedded, and automotive applications makes it a superior choice over generic PMICs. Engineers benefit from NXP’s proven reliability and a compact form factor, reducing design complexity and time-to-market for power-sensitive projects.

MC32PF3001A7EPR2 Documents

Download datasheets and manufacturer documentation for MC32PF3001A7EPR2

PCN Assembly/Origin :

Mult Dev A/T Chg 20/Apr/2021      

Datasheets :

MC3xPF3001      

PCN Packaging :

Automated Packing Implementation 05/Jul/2023      

HTML Datasheet :

MC3xPF3001 Fact Sheet      

Environmental Information :

NXP USA Inc REACH       NXP USA Inc RoHS Cert