NXP Semiconductors
MC33662SEFR2

710-MC33662SEFR2
PDF Datasheet
IC TRANSCEIVER HALF 1/1 8SOIC

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Tech Specifications

Number of Drivers/Receivers
1/1
Operating Temperature
-40°C ~ 125°C
ECCN
EAR99
Mounting Type
Surface Mount
Product Status
Not For New Designs
Receiver Hysteresis
175 mV
Duplex
Half
Supplier Device Package
8-SOIC
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MC33662SEFR2 Description

The Tape & Reel (TR) for this electronic equipment is available. The packaging way of this MC33662SEFR2 is to conserve time, space, energy, and resources. This MC33662SEFR2 offers cheap cost, adaptability, dependability, efficiency, and consistency. This MC33662SEFR2 is produced by NXP Semiconductors and is used in a variety of industries. This manufacturer aspires to rank among the top electronic vendors in the Asia-Pacific region. Additionally, it hopes to contribute significantly to the sector's expansion. This MC33662SEFR2 falls under the Drivers, Receivers, Transceivers category. The most advanced level of this category is Interface IC Chips. IC interfaces differ in terms of device types and applications. Some products are used with buffers, cardbus controllers, and crosspoint switches.

FAQ

What is the mounting type of MC33662SEFR2?
MC33662SEFR2 uses a Surface Mount mounting style based on the listed product specifications.
Is MC33662SEFR2 currently in stock?
What package or case is MC33662SEFR2 available in?
Are there related or alternative parts for MC33662SEFR2?
Does MC33662SEFR2 have quantity-based pricing?
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