NXP Semiconductors

MC33FS6502LAER2  

Specialized Power Management

MC33FS6502LAER2 Description

The MC33FS6502LAER2 from NXP Semiconductors is a highly integrated System Basis Chip (SBC) designed for advanced automotive and industrial power management applications. This surface-mount device operates within a 1V to 5V supply voltage range, making it suitable for low-power and high-efficiency systems. Packaged in Tape & Reel (TR) and compliant with ROHS3 and REACH standards, it meets stringent environmental and safety requirements. With a Moisture Sensitivity Level (MSL) of 3 (168 Hours), it ensures reliability in humid conditions. The SBC integrates a DC-DC converter capable of delivering 0.8A and features a Voltage-Controlled Oscillator (VCO), enhancing its versatility in timing and power regulation applications.

MC33FS6502LAER2 Features

• Integrated DC-DC Converter: Provides efficient power conversion with 0.8A output current, reducing the need for external components.
• Wide Voltage Range (1V–5V): Supports diverse power supply configurations, ideal for battery-operated and low-voltage systems.
• VCO Integration: Enables precise frequency generation for clock synchronization and signal processing.
• Automotive-Grade Reliability: Compliant with AEC-Q100 standards, ensuring robustness in harsh environments.
• Compact and Efficient: Surface-mount design minimizes board space while maximizing performance.
• Low Power Consumption: Optimized for energy-sensitive applications, extending battery life in portable devices.

MC33FS6502LAER2 Applications

• Automotive Systems: Ideal for ECUs (Electronic Control Units), infotainment, and ADAS (Advanced Driver Assistance Systems) due to its high reliability and integration.
• Industrial Power Management: Suitable for factory automation, sensors, and IoT devices requiring efficient power conversion.
• Portable Electronics: Powers wearables and handheld devices with its low-voltage operation and compact footprint.
• Telecommunications: The integrated VCO supports RF and timing circuits in communication modules.

Conclusion of MC33FS6502LAER2

The MC33FS6502LAER2 stands out as a highly integrated, efficient, and reliable System Basis Chip for modern power management challenges. Its combination of DC-DC conversion, VCO, and automotive-grade durability makes it a superior choice over discrete solutions, reducing design complexity and BOM costs. Whether in automotive, industrial, or portable electronics, this SBC delivers performance, flexibility, and compliance with global standards, making it a future-proof solution for engineers.

MC33FS6502LAER2 Documents

Download datasheets and manufacturer documentation for MC33FS6502LAER2

PCN Assembly/Origin :

Mult Dev A/T Site 28/Apr/2021      

Datasheets :

F6500, F4500 Data Short       FS65, FS45 Fact Sheet      

PCN Packaging :

Mult Dev Pkg Seal 15/Dec/2020       Automated Packing Implementation 05/Jul/2023      

HTML Datasheet :

FS65, FS45 Fact Sheet      

PCN Design/Specification :

MC3xFSx 26/May/2022       FS6500/FS4500 Manual Update 13/Jan/2022      

Environmental Information :

NXP USA Inc REACH       NXP USA Inc RoHS Cert