NXP Semiconductors_MC33FS6518CAER2
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NXP Semiconductors
MC33FS6518CAER2

761-MC33FS6518CAER2
PDF Datasheet
SYSTEM BASIS CHIP, DCDC 1.5A VCO
52 Weeks

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Tech Specifications

Product
Safety Power System
Product Status
Active
Input Voltage - Max
2.7 V
Supplier Device Package
48-HLQFP (7x7)
RoHS
RoHS Compliant
Input Voltage - Min
2.7 V
Package / Case
48-LQFP Exposed Pad
Voltage - Supply
1V ~ 5V
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MC33FS6518CAER2 Description

MC33FS6518CAER2 Description

The MC33FS6518CAER2 is a highly integrated System Basis Chip (SBC) designed for automotive applications, offering a comprehensive power management solution in a compact form factor. Manufactured by NXP Semiconductors, this device is engineered to meet the stringent requirements of the automotive industry, ensuring reliability and performance in demanding environments. The MC33FS6518CAER2 features a wide input voltage range of 1V to 5V, making it suitable for a variety of power supply configurations. It is packaged in a surface mount format, specifically in a Tape & Reel (TR) configuration, which facilitates easy integration into modern automotive electronic systems.

MC33FS6518CAER2 Features

The MC33FS6518CAER2 stands out due to its unique combination of features tailored for automotive applications. Key highlights include:

  • Wide Input Voltage Range: The device operates efficiently within a voltage range of 1V to 5V, providing flexibility in power supply design.
  • High Current Capability: With a DCDC converter capable of delivering up to 1.5A, the MC33FS6518CAER2 can power demanding automotive electronics.
  • VCO Integration: The inclusion of a Voltage Controlled Oscillator (VCO) enhances the chip's functionality, enabling precise control and synchronization in complex systems.
  • Automotive Grade: Certified for automotive use, the MC33FS6518CAER2 meets the highest standards for reliability and durability, ensuring long-term performance in harsh environments.
  • Compliance and Safety: The device is REACH unaffected and ROHS3 compliant, adhering to environmental regulations and ensuring safe usage in automotive applications.
  • Packaging: The surface mount Tape & Reel (TR) packaging ensures ease of integration and scalability in production processes.

MC33FS6518CAER2 Applications

The MC33FS6518CAER2 is ideally suited for a range of automotive applications where reliable power management and integration capabilities are critical. Specific use cases include:

  • Advanced Driver Assistance Systems (ADAS): The high current capability and wide voltage range make it ideal for powering complex ADAS modules, ensuring reliable operation in varying conditions.
  • Infotainment Systems: The integration of a VCO and wide voltage range allows for seamless operation of infotainment systems, providing stable power and precise control.
  • Body Electronics: The compact surface mount package and automotive grade reliability make it suitable for body electronics, where space is limited and durability is essential.
  • Telematics and Connectivity Modules: The MC33FS6518CAER2 can power telematics and connectivity modules, ensuring stable performance and efficient power management.

Conclusion of MC33FS6518CAER2

The MC33FS6518CAER2 from NXP Semiconductors is a versatile and reliable System Basis Chip designed to meet the specific needs of the automotive industry. Its wide input voltage range, high current capability, and integrated VCO offer significant advantages over similar models, making it an ideal choice for a variety of automotive applications. With its automotive grade certification, REACH unaffected status, and ROHS3 compliance, the MC33FS6518CAER2 ensures long-term reliability and adherence to environmental standards. Whether powering ADAS modules, infotainment systems, or body electronics, the MC33FS6518CAER2 provides a robust and efficient power management solution tailored for the demands of modern automotive electronics.

FAQ

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