NXP Semiconductors

MC33PF8200DMESR2  

Specialized Power Management

This electronic device regards Tape & Reel (TR) method as the top priority. This MC33PF8200DMESR2 packaging method makes it simple and quick to package big quantities of powdered commodities. This MC33PF8200DMESR2 is produced by this NXP Semiconductors in order to provide enough products to meet consumers’ demand. The blueprint of this NXP Semiconductors is to keep pace with the growth of world’s leading level of science and technology. This MC33PF8200DMESR2 belongs to Specialized Power Management category. It’s previous category pertains to Power Management (PMIC). Complete power supply systems can be implemented using Power Management Integrated Circuits (PMICs). It combines several voltage regulators and control circuits onto a single chip. They simplify and cost-effectively manage system power management while reducing component count and board area. This MC33PF8200DMESR2 is a great fit for embedded processing in a variety of applications. They are includes edge computing, the Internet of Things (IoT), industrial and medical IoT, electric vehicles (EVs), and autonomous cars.

MC33PF8200DMESR2 Documents

Download datasheets and manufacturer documentation for MC33PF8200DMESR2

PCN Assembly/Origin :

Mult Dev A/T Site 28/Apr/2021      

Datasheets :

PF8100, PF8200      

PCN Packaging :

All Dev Label Update 15/Dec/2020       Mult Dev Pkg Seal 15/Dec/2020      

PCN Design/Specification :

Mult Dev DS Update 26/Feb/2021      

Environmental Information :

NXP USA Inc REACH       NXP USA Inc RoHS Cert