NXP Semiconductors

MC56F8006VLF  

Microcontrollers

The MC56F8006VLF is a microcontroller unit (MCU) manufactured by NXP Semiconductors. It is a member of the S08 family of 8-bit MCUs and is designed for use in a variety of applications, including automotive, industrial, and consumer electronics.

Description:

The MC56F8006VLF is a high-performance, low-power MCU that features a 32-bit CPU core and a range of integrated peripherals. It is available in a 100-pin LQFP package and operates over a wide temperature range of -40°C to +125°C.

Features:

Some of the key features of the MC56F8006VLF include:

1. 32-bit CPU core with up to 40 MIPS performance
2. Up to 512 kB of on-chip flash memory
3. Up to 64 kB of on-chip RAM
4. Integrated peripherals, including UART, SPI, I2C, and CAN
5. Advanced security features, including secure boot and flash encryption
6. Low-power modes to extend battery life in portable applications
7. Wide operating temperature range for use in harsh environments

Applications:

The MC56F8006VLF is suitable for a wide range of applications, including:

1. Automotive applications, such as body control modules, instrument clusters, and infotainment systems
2. Industrial control systems, such as motor control, robotics, and automation equipment
3. Consumer electronics, such as smart home devices, wearables, and portable medical devices
4. Networking and communications equipment, such as routers, switches, and modems
5. Security systems, such as access control and video surveillance

Overall, the MC56F8006VLF is a versatile and powerful MCU that offers a range of features and capabilities to meet the demands of a variety of applications. Its low-power design and advanced security features make it well-suited for use in battery-powered devices and applications where security is a concern.

MC56F8006VLF Documents

Download datasheets and manufacturer documentation for MC56F8006VLF

PCN Assembly/Origin :

Mult Dev Site Chgs 18/Dec/2020      

Datasheets :

MC56F8002/8006      

PCN Packaging :

All Dev Label Update 15/Dec/2020       Mult Dev Pkg Seal 15/Dec/2020      

PCN Design/Specification :

Copper Wirebond Material 28/May/2014      

Environmental Information :

NXP USA Inc REACH       NXP USA Inc RoHS Cert