NXP Semiconductors

PUMH2,115

PUMH2,115 Description

The PUMH2,115 from NXP Semiconductors is a small-signal bipolar transistor array designed for surface-mount applications. Part of the NEXPERIA series, it integrates pre-biased resistors (R1 = 47kΩ, R2 = 47kΩ) to simplify circuit design and reduce component count. With a collector-emitter breakdown voltage (Vce) of 50V and a maximum collector current (Ic) of 100mA, it is optimized for low-power switching and amplification. The device features a low Vce saturation (150mV @ 500µA, 10mA) and a high DC current gain (hFE ≥ 80 @ 5mA, 5V), ensuring efficient performance in precision applications. Packaged in bulk and rated MSL 1 (unlimited), it is suitable for automated assembly processes.

PUMH2,115 Features

• Pre-biased resistors (47kΩ base & emitter) for simplified design.
• Low saturation voltage (150mV @ 10mA) for energy-efficient switching.
• High current gain (hFE ≥ 80 @ 5mA, 5V) for reliable signal amplification.
• 50V collector-emitter breakdown voltage for robust operation.
• Surface-mount (SMD) package compatible with high-density PCBs.
• REACH unaffected and MSL 1 rated for environmental compliance and ease of handling.
• Low cutoff current (1µA max) minimizes leakage in standby modes.

PUMH2,115 Applications

• Signal amplification in audio and sensor interfaces.
• Load switching in portable and IoT devices.
• Logic level shifting in microcontroller interfaces.
• Automotive electronics (e.g., lighting control, sensors).
• Consumer electronics (remote controls, smart home devices).
• Industrial control systems requiring low-power, high-reliability transistors.

Conclusion of PUMH2,115

The PUMH2,115 stands out for its integrated resistors, low saturation voltage, and high gain, making it ideal for space-constrained, low-power designs. Its surface-mount compatibility and REACH compliance further enhance its suitability for modern electronics. Whether used in consumer, automotive, or industrial applications, this transistor array delivers performance, reliability, and design simplicity, reducing both BOM complexity and assembly costs.