NXP Semiconductors
SPC5775BDK3MME2

685-SPC5775BDK3MME2
PDF Datasheet
IC MCU 32BIT 4MB FLASH 416MAPBGA
52 Weeks

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ISO9001
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ISO45001
ISO14001
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Tech Specifications

Unit Weight
0.099585 oz
Program Memory Type
FLASH
Product
MCUs
PPAP
Yes
Data Bus Width (bit)
32
Product Status
Active
SPI
5
Automotive
Yes
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SPC5775BDK3MME2 Description

The SPC5775BDK3MME2 is a development kit from NXP Semiconductors, designed for the development and testing of automotive applications using the S32K3 MCU family. Here's a description of the model, its features, and potential applications:

Description:

The SPC5775BDK3MME2 is a comprehensive development kit that provides a robust platform for engineers and developers to design, prototype, and test automotive electronic systems. It is based on the S32K3 family of microcontrollers, which are known for their high performance, advanced safety features, and robust connectivity options.

Features:

  1. Microcontroller: The kit is built around the S32K3 MCU, which offers a combination of high performance and low power consumption, making it ideal for automotive applications.

  2. Safety Features: The development kit includes features that support functional safety, such as the capability to meet ISO 26262 standards, which is crucial for automotive applications.

  3. Connectivity: The kit supports a wide range of connectivity options, including Ethernet, USB, and CAN, which are essential for modern automotive systems.

  4. Peripherals: The SPC5775BDK3MME2 comes with a variety of peripherals, such as motor control timers, PWM modules, and high-resolution analog-to-digital converters, which are useful for developing complex automotive systems.

  5. Debugging and Programming: The kit includes tools for debugging and programming the microcontroller, making it easier for developers to test and refine their designs.

  6. Documentation and Support: NXP provides comprehensive documentation, software, and technical support to assist developers in making the most of the SPC5775BDK3MME2.

Applications:

  1. Advanced Driver Assistance Systems (ADAS): The development kit can be used to design and test ADAS, which include features like lane departure warning, adaptive cruise control, and automatic emergency braking.

  2. Body Control Modules: The SPC5775BDK3MME2 is suitable for developing body control modules that manage various functions such as lighting, locks, and windows.

  3. Powertrain Control: The kit can be used to develop control systems for engines, transmissions, and other powertrain components.

  4. Infotainment Systems: The development kit can be used to create infotainment systems that integrate audio, video, navigation, and communication features.

  5. Safety Systems: The SPC5775BDK3MME2 can be used to develop safety systems, such as airbag controllers and vehicle stability control systems.

  6. Networking and Communication: The kit is ideal for developing systems that require robust networking and communication capabilities, such as vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) systems.

In summary, the SPC5775BDK3MME2 from NXP Semiconductors is a versatile development kit that provides a comprehensive platform for the design and testing of various automotive electronic systems, with a focus on safety, performance, and connectivity.

FAQ

What is the mounting type of SPC5775BDK3MME2?
SPC5775BDK3MME2 uses a Surface Mount mounting style based on the listed product specifications.
Are there related or alternative parts for SPC5775BDK3MME2?
Is SPC5775BDK3MME2 currently in stock?
What operating temperature range does SPC5775BDK3MME2 support?
What is SPC5775BDK3MME2?
Availability (In Stock : 123 )
Quantity Unit Price Ext. Price
1+ $34.08240 $34.08
10+ $27.90656 $279.07
25+ $26.36269 $659.07
200+ $25.44300 $5088.60
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