NXP Semiconductors_SSTUA32864EC,557
original

NXP Semiconductors
SSTUA32864EC,557

703-SSTUA32864EC,557
IC BUFFER 1.8V 25BIT SOT536 / 1:1, 1:2 Configurable Registered Buffer IC 96-LFBGA (13.5x5.5)

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APAC
ISO9001
Quality Policy
ISO45001
ISO14001
Original

Tech Specifications

MSL Level
3 (168 Hours)
Other Names
935279439557,SSTUA32864EC,SSTUA32864EC
ECCN
EAR99
Product Status
Obsolete
Supplier Device Package
96-LFBGA (13.5x5.5)
Standard Package
1,425
Mounting
SMD (SMT)
Package / Case
96-LFBGA
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SSTUA32864EC,557 Description

This electronic part uses a Tray method. The purpose of this SSTUA32864EC,557 packaging is to shield things from moisture and stop the growth of mold and mildew. This SSTUA32864EC,557 is manufactured by NXP Semiconductors, which also produces a lot of these goods. The goal of NXP Semiconductors is to share a passion in electronics field and keep moving to provide highest standards with many people around the world. This SSTUA32864EC,557 belongs to the category Specialty Logic ICs and it is a portion of the Logic IC Chips. A logic IC is a semiconductor device. It implements a basic logical operation that is performed on one or more digital input signals. This SSTUA32864EC,557 are widely used in microprocessors, computers, computer networks, frequency counters and digital signal processors. Other subcategories within this category include memory chips, interface ICs, logic OCs, and programmable ICs.

FAQ

What is the mounting type of SSTUA32864EC,557?
SSTUA32864EC,557 uses a SMD (SMT) mounting style based on the listed product specifications.
What is SSTUA32864EC,557?
What package or case is SSTUA32864EC,557 available in?
What voltage specification is listed for SSTUA32864EC,557?
Is SSTUA32864EC,557 currently in stock?
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