NXP Semiconductors_TEA9123BTY
NXP Semiconductors_TEA9123BTY
original

NXP Semiconductors
TEA9123BTY

760-TEA9123BTY
TEA9123BT
16 Weeks

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Tech Specifications

Series
TEA9123BT
Package / Case
16-SOIC (0.154", 3.90mm Width)
REACH Status
REACH Unaffected
Mfr
NXP USA Inc.
Package
Tape & Reel (TR)
Mounting Type
Surface Mount
Product Status
Active
RoHS Status
ROHS3 Compliant
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TEA9123BTY Description

TEA9123BTY Description

The TEA9123BTY is a high-performance Power Management Integrated Circuit (PMIC) designed to deliver efficient power solutions for a wide range of electronic devices. Manufactured by NXP Semiconductors, this component is part of the Power Management category and is known for its robustness and reliability. The TEA9123BTY is available in a Tape & Reel (TR) package, making it ideal for surface mount applications. It is currently an active product, ensuring that it meets the latest industry standards and compliance requirements, including REACH Unaffected and ROHS3 Compliant statuses.

TEA9123BTY Features

The TEA9123BTY stands out due to its advanced technical specifications and performance benefits. Key features include:

  • Efficient Power Management: The TEA9123BTY is designed to provide efficient power conversion and management, ensuring minimal power loss and optimal energy utilization. This makes it highly suitable for applications where energy efficiency is critical.
  • Surface Mount Compatibility: The surface mount mounting type allows for easy integration into modern PCB designs, facilitating compact and space-efficient electronic systems.
  • Compliance and Safety: The REACH Unaffected and ROHS3 Compliant statuses ensure that the TEA9123BTY meets stringent environmental and safety standards, making it a responsible choice for manufacturers aiming to reduce their environmental impact.
  • Tape & Reel Packaging: The TEA9123BTY is packaged in a Tape & Reel format, which is ideal for automated assembly processes, enhancing production efficiency and reducing assembly costs.

TEA9123BTY Applications

The TEA9123BTY is versatile and can be applied in various electronic systems where efficient power management is essential. Specific use cases include:

  • Consumer Electronics: Ideal for powering devices such as smartphones, tablets, and laptops, where compact design and energy efficiency are paramount.
  • Industrial Equipment: Suitable for industrial control systems and automation equipment, where reliable power management is crucial for continuous operation.
  • Telecommunications: Can be used in base stations and networking equipment to ensure stable power supply and efficient energy use.
  • Automotive Electronics: Applicable in automotive systems, including infotainment and advanced driver-assistance systems (ADAS), where high reliability and performance are required.

Conclusion of TEA9123BTY

The TEA9123BTY by NXP Semiconductors is a standout PMIC that offers a blend of advanced technical specifications, performance benefits, and compliance with industry standards. Its efficient power management capabilities, surface mount compatibility, and robust packaging make it an ideal choice for a variety of applications across consumer electronics, industrial equipment, telecommunications, and automotive sectors. With its REACH Unaffected and ROHS3 Compliant status, the TEA9123BTY also aligns with environmental and safety standards, making it a responsible and future-proof solution for modern electronic designs.

FAQ

What package or case is TEA9123BTY available in?
TEA9123BTY is available in the 16-SOIC (0.154", 3.90mm Width) package / case.
What is the standard lead time for TEA9123BTY?
What is TEA9123BTY?
Is TEA9123BTY currently in stock?
What is the mounting type of TEA9123BTY?
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