onsemi_FDG6335N

onsemi
FDG6335N  
FET, MOSFET Arrays

onsemi
FDG6335N
289-FDG6335N
Ersa
onsemi-FDG6335N-datasheets-11726417.pdf
MOSFET 2N-CH 20V 0.7A SC88
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FDG6335N Description

The FDG6335N is a high-power MOSFET transistor manufactured by ON Semiconductor. It is designed for use in a variety of power electronic applications, including motor control, power supplies, and power converters.

Description:

The FDG6335N is an N-channel MOSFET transistor with a high input impedance, low output impedance, and fast switching capabilities. It features a high voltage rating of 100V and a continuous drain current of 33A. The device is available in a TO-220AB package.

Features:

  • N-channel, high-power MOSFET transistor
  • High voltage rating of 100V
  • Continuous drain current of 33A
  • High input impedance and low output impedance
  • Fast switching capabilities
  • Available in a TO-220AB package

Applications:

The FDG6335N is suitable for use in a variety of power electronic applications, including:

  • Motor control
  • Power supplies
  • Power converters
  • Battery management systems
  • Inverters
  • Switch mode power supplies (SMPS)
  • Class D audio amplifiers

Overall, the FDG6335N is a versatile and high-performance MOSFET transistor that can be used in a wide range of power electronic applications. Its high voltage rating, fast switching capabilities, and low output impedance make it an ideal choice for demanding power conversion and control applications.

Tech Specifications

Operating Temperature
FET Feature
Configuration
Input Capacitance (Ciss) (Max) @ Vds
Gate Charge (Qg) (Max) @ Vgs
ECCN
Mounting Type
Product Status
Rds On (Max) @ Id, Vgs
Vgs(th) (Max) @ Id
Supplier Device Package
Drain to Source Voltage (Vdss)
Series
Package / Case
Technology
Power - Max
REACH Status
Mfr
Current - Continuous Drain (Id) @ 25°C
HTSUS
Package
RoHS Status
Base Product Number
Moisture Sensitivity Level (MSL)
Typical Input Capacitance @ Vds (pF)
Category
PCB changed
Typical Turn-Off Delay Time (ns)
HTS
Number of Elements per Chip
ECCN (US)
Typical Rise Time (ns)
PPAP
Maximum Power Dissipation (mW)
Channel Mode
Typical Turn-On Delay Time (ns)
Automotive
Minimum Operating Temperature (°C)
Maximum Operating Temperature (°C)
Supplier Package
Typical Fall Time (ns)
Process Technology
Package Height
Channel Type
EU RoHS
Maximum Continuous Drain Current (A)
Maximum Gate Source Voltage (V)
Maximum Drain Source Voltage (V)
Maximum Drain Source Resistance (mOhm)
Package Length
Typical Gate Charge @ 10V (nC)
Standard Package Name
Pin Count
Mounting
Part Status
Package Width
Typical Gate Charge @ Vgs (nC)

FDG6335N Documents

Download datasheets and manufacturer documentation for FDG6335N

Ersa Mult Dev 27/Sep/2023      
Ersa FDG6335N      
Ersa Mult Devices 24/Oct/2017       Binary Year Code Marking 15/Jan/2014      
Ersa 2N7002x/BSSx/FDGx/FDVx/NDS06x 10/May/2022       Marking Lay-out Implementation 07/Oct/2022      
Ersa onsemi RoHS       Material Declaration FDG6335N       onsemi REACH      

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