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EXB-2HN824JV

EXB-2HN824JV Description

The EXB-2HN824JV from Panasonic Electronic Components is a high-performance resistor network/array designed for precision applications in modern electronics. This surface-mount device (SMD) features two 820kΩ resistors in a compact 1506 (0402 metric) package, making it ideal for space-constrained PCB designs. Compliant with REACH Unaffected and ECCN EAR99 regulations, it ensures environmental and export compliance. The Tape & Reel (TR) packaging facilitates automated assembly processes, enhancing manufacturing efficiency. With an HTSUS code of 8533.21.0020, this active-status component is optimized for high-frequency (HF) applications, offering stable performance in demanding circuits.

EXB-2HN824JV Features

• Precision Resistance: Two 820kΩ resistors with tight tolerance for accurate signal conditioning.
• Compact Design: 1506 (0402) package saves board space while maintaining reliability.
• High-Frequency Suitability: Optimized for HF applications, minimizing parasitic effects.
• Automation-Ready: Tape & Reel (TR) packaging streamlines pick-and-place assembly.
• Compliance: REACH Unaffected and EAR99 classification ensure global usability.
• Robust Performance: Stable operation across temperature variations and environmental stress.

EXB-2HN824JV Applications

The EXB-2HN824JV excels in:

• Signal Termination & Pull-Up/Down Circuits: Ensures stable logic levels in digital systems.
• Voltage Dividers: Precision division in sensor interfaces or ADC front-ends.
• High-Frequency PCBs: Minimizes signal loss in RF/microwave designs.
• Consumer Electronics: Space-efficient solutions for smartphones, wearables, and IoT devices.
• Industrial Controls: Reliable performance in harsh environments due to robust construction.

Conclusion of EXB-2HN824JV

The Panasonic EXB-2HN824JV resistor array stands out for its compact size, high-frequency capability, and compliance-ready design, making it a superior choice for modern electronics. Its 820kΩ resistance values and automation-friendly packaging cater to high-volume production, while its HF optimization ensures signal integrity. Ideal for space-constrained, high-performance applications, this component combines precision, reliability, and manufacturability—key attributes for next-generation circuit designs.