Panasonic

EXB-2HV274JV

EXB-2HV274JV Description

The EXB-2HV274JV from Panasonic Electronic Components is a high-performance 8-resistor array designed for precision surface-mount applications. Housed in a compact 1506, Convex, Long Side Terminals package (3.80mm x 1.60mm), this device features isolated resistors with a 270k Ohm resistance and a ±5% tolerance, ensuring reliable performance in diverse circuits. With a ±200ppm/°C temperature coefficient and 62.5mW power rating per element, it delivers stable operation across varying environmental conditions. Compliant with ROHS3 and REACH standards, this Moisture Sensitivity Level (MSL) 1 component is ideal for automated assembly processes, supplied in Tape & Reel (TR) packaging for efficiency.

EXB-2HV274JV Features

• High-Density Integration: 8 isolated resistors in a space-saving 1506 (3.80mm x 1.60mm) footprint.
• Robust Performance: ±200ppm/°C temperature coefficient ensures minimal drift in harsh environments.
• Reliable Tolerance: ±5% resistance tolerance for consistent signal integrity.
• Low-Profile Design: 0.022" (0.55mm) height suits thin-profile PCB designs.
• Automation-Ready: Tape & Reel (TR) packaging streamlines high-volume SMT assembly.
• Compliance: ROHS3, REACH Unaffected, and ECCN EAR99 certified for global use.

EXB-2HV274JV Applications

• Voltage Division: Precision dividers in sensor interfaces and ADC circuits.
• Pull-Up/Pull-Down Networks: Signal conditioning in digital logic (e.g., I²C, SPI).
• Industrial Electronics: PLCs, motor controls, and power management systems.
• Consumer Electronics: Compact devices like wearables and IoT modules.
• Automotive Systems: Non-critical resistive networks in infotainment or lighting.

Conclusion of EXB-2HV274JV

The EXB-2HV274JV resistor array combines Panasonic’s reliability with optimized space-efficiency and thermal stability, making it a superior choice for applications demanding high-density, low-profile passive networks. Its wide operating tolerance, compliance certifications, and automation-friendly packaging position it as a versatile solution for modern industrial, automotive, and consumer electronics. Engineers benefit from its balanced performance-to-size ratio, reducing PCB footprint without compromising functionality.