Panasonic

EXB-2HV622JV

EXB-2HV622JV Description

The EXB-2HV622JV from Panasonic Electronic Components is a high-performance 8-resistor network designed for precision surface-mount applications. Encased in a compact 1506, convex, long-side terminal package (3.80mm x 1.60mm), this ROHS3-compliant and REACH-unaffected device offers a 6.2kΩ resistance per element with a ±5% tolerance and ±200ppm/°C temperature coefficient. Its isolated circuit configuration ensures independent resistor operation, while the 62.5mW power rating per element balances efficiency and reliability. Ideal for high-density PCB designs, the EXB-2HV622JV is supplied in tape & reel (TR) packaging, supporting automated assembly processes.

EXB-2HV622JV Features

• Compact Footprint: 1506 package (0.150" x 0.063") with a low profile (0.022" height) for space-constrained designs.
• Stable Performance: ±200ppm/°C temperature coefficient ensures minimal resistance drift across operating conditions.
• High Reliability: MSL 1 (Unlimited) moisture sensitivity and ROHS3/REACH compliance meet stringent environmental standards.
• Optimized Power Handling: 62.5mW per resistor enables robust operation in signal conditioning and divider circuits.
• Automation-Friendly: Tape & reel packaging streamlines high-volume SMT assembly.

EXB-2HV622JV Applications

• Consumer Electronics: Voltage division and pull-up/down networks in smartphones, wearables, and IoT devices.
• Industrial Controls: Signal isolation and impedance matching in PLCs and sensor interfaces.
• Automotive Systems: ECU signal conditioning where stable resistance under thermal stress is critical.
• Medical Devices: Precision analog circuits requiring low-profile, high-density resistor arrays.

Conclusion of EXB-2HV622JV

The EXB-2HV622JV excels in applications demanding miniaturization, stability, and repeatability, leveraging Panasonic’s expertise in passive components. Its isolated design, tight tolerance, and robust construction make it a superior choice over generic resistor arrays, particularly in automotive and industrial environments where thermal and mechanical stress are concerns. Engineers will appreciate its balance of performance, size, and compliance, ensuring seamless integration into next-generation electronic systems.