Panasonic

EXB-A10P473J

EXB-A10P473J Description

The EXB-A10P473J from Panasonic Electronic Components is a high-performance 8-resistor bussed array designed for precision surface-mount applications. Housed in a compact 2512 (6432 Metric) concave package with long side terminals, this device offers a 47kΩ resistance per element with a ±5% tolerance and ±200ppm/°C temperature coefficient. Its 62.5mW power rating per element and low-profile 0.026" (0.65mm) height make it ideal for space-constrained designs. The ROHS3-compliant and REACH-unaffected construction ensures environmental compliance, while its MSL 1 (Unlimited) rating guarantees reliability in humid conditions. Packaged in Tape & Reel (TR), it suits automated assembly processes.

EXB-A10P473J Features

• 8-resistor bussed network simplifies circuit design by reducing component count.
• Compact 2512 package (6.40mm x 3.10mm) with concave terminals for robust solder joint integrity.
• ±200ppm/°C thermal stability ensures consistent performance across temperature variations.
• 62.5mW power dissipation per element balances efficiency and thermal management.
• ROHS3/REACH compliant and MSL 1 rated for broad industrial and consumer applications.
• Tape & Reel packaging optimizes high-volume PCB assembly.

EXB-A10P473J Applications

This resistor array excels in:

• Voltage division and pull-up/down circuits in IoT devices and sensors.
• Signal conditioning for industrial control systems and automotive electronics.
• Power supply decoupling in consumer electronics like smart home devices.
• Space-constrained PCBs due to its ultra-low profile (0.65mm) and high-density layout.
• Automated manufacturing environments leveraging its T&R packaging for efficiency.

Conclusion of EXB-A10P473J

The EXB-A10P473J combines Panasonic’s reliability with a space-saving design, making it a superior choice for high-density, precision circuits. Its bussed architecture, thermal stability, and compliance with environmental standards position it as a versatile solution for industrial, automotive, and consumer applications. Engineers benefit from reduced BOM complexity and enhanced manufacturability, ensuring cost-effective and scalable designs.